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Table of Contents
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Overview
The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.
See "4 x 5 SoM Carriers" page for more information about supported 4 x 5 cm SoMs.
Refer to http://trenz.org/te0706-info for the current online version of this manual and other available documentation.
Key Features
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- 3 x Samtec LSHM Series Board to Board Connectors
- VG96 connector (mounting holes and solder pads, J6 1)) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
- USB2.0 type A connector, or optionally Micro USB 2.0 connector
- 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
- 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
- 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
- XMOD JTAG- / UART-header JX1
- Micro SD card socket
- SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
- DIP-switches S1 to set SoM's control signals
- 1 x user-push button (S2), by default configured as system reset button
- 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
- 5V power supply barrel jack
Additional assembly options are available for cost or performance optimization upon request.
1) No longer delivered within board. Needs to be ordered seperately. Refer to PCN-20231106 TE0706-03 BOM Change for more information.
Block Diagram
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Main Components
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- 5V power connector jack, J1
- Reset switch, S2
- USB2.0 type A receptacle, J7
- Micro SD card socket with Card Detect, J4
- 50 pin IDC male connector, J5
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
- XMOD JTAG- / UART-header, JX1
- User DIP-switch, S1
- VCCIO selection jumper block, J10 - J12
- External connector (VG96) placeholder, J6
- Samtec Razor Beam™ LSHM-150 B2B connector, JB1
- Samtec Razor Beam™ LSHM-150 B2B connector, JB2
- Samtec Razor Beam™ LSHM-130 B2B connector, JB3
- SoM SDIO voltage selection jumper, J13
Initial Delivery State
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Notes : Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
There is no hardware component to be programmed on the carrier.
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Board is shipped in following configuration:
- VCCIO voltage selection jumpers are all set to 1.8 V.
- S2 switch configured as reset button.
Different delivery configurations are available upon request.
Configuration Signals
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There is a user push button which is used for RESET signal.
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Signals, Interfaces and Pins
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Board to Board (B2B) I/Os
With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/Os are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/Os properly.
Following table gives a summary of the available I/Os, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:
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On-board Connector
The TE0706 Carrier Board has a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/Os are available to the user, a large quantity of these I/Os are also usable as differential pairs.
Following table gives a summary of the pin-assignment, available interfaces and functional I/Os of the connectors J5 and J6:
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JTAG/UART Interface Base
JTAG/UART access to the TE0706 carrier is available through XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. This header provides also a UART interface, usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. XMOD USB2.0 to JTAG/UART adapter TE0790 is provided by Trenz Electronic. More information is available here. Devices of the mounted SoM can be programed via USB2.0 interface.
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When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:
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Use AMD compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the AMD Zynq devices. The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download. |
SD Card Socket
The SD Socket is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V/3.3V depending on Module, compare jumper J13 ):
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USB2.0 connector
TE0706-03 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.
There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.
For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.
Following table gives an overview of the USB2.0 connector signals:
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RJ45 Gigabit Ethernet Connectors
The TE0706 Carrier Board is equipped with two Gigabit Ethernet ports. One of them (J2) is routed to Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6). The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY. The MegJack J3 is connected via MDI directly to the B2B connector JB1. There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.
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MIO Pins
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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic. Example:
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On-board Peripherals
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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4-bit DIP-switch
Table below describes DIP-switch S1 settings for configuration of the mounted SoM:
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Note: Compared to the former revision 02 of this board, the DIP-switch is rotated by 180° due to routing issues. |
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VCC Selection Jumpers
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Note: The corresponding PL I/O-bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model. Refer to the SoM's schematic for information about the specific pin assignments on module's B2B-connectors regarding the PL I/O-bank supply-voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options. |
The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.
Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:
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Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.
Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.
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Take care of the VCCO voltage ranges of the particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges. It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM. |
The SDIO voltage on the SoM side can be selected by jumper J13.
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RTC Buffer Voltage Supply Header
The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.
Push Button
The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.
Gigabit Ethernet PHY
The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. The I/O Voltage is fixed at 1.8V. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.
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SDIO Port Expander
The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the AMD Zynq module has VCCIO of 1.8V or 3.3V depending on the attached module. This has to be selected by J13.
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Power and Power-On Sequence
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
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Power Supply
Power supply with minimum current capability of 3A for system startup is recommended.
Power Consumption
The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.
AMD provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
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* TBD - To Be Determined.
Power supply with minimum current capability of 3A for system startup is recommended.
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To avoid any damage to the module, check for stabilized on-board voltages and VCCIOs before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence. |
Power Distribution Dependencies
The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:
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Power Rails
The voltage direction of the power rails is directed at on-board connectors' view:
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Board to Board Connectors
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Technical Specifications
Absolute Maximum Ratings
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range (-40 °C ..+85 °C).
Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.
Physical Dimensions
Board size: PCB 100mm × 64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.
Mating height of the module with standard connectors: 8mm
PCB thickness: 1.65mm
Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.
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In 'Physical Dimension' section, top and button view of module must be insterted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
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All dimensions are given in millimeters.
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Currently Offered Variants
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Set correct link to the shop page overview table of the product on English and German. Example for TE0728: ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ if not available, set. |
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Revision History
Hardware Revision History
List of online PCNs can be found here.
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Document Change History
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Table of Contents
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Overview
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Refer to https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/carrier_boards/TE0706 for downloadable version of this manual and additional technical documentation of the product. |
The Trenz Electronic TE0706 carrier board provides functionality for testing, evaluation and development purposes of company's 4 x 5 cm SoMs (System on Module). The carrier board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional components and multipurpose I/Os of the SoM's PL logic are connected via board-to-board connectors to the carrier board's components and connectors for easy user access.
See "4 x 5 cm carriers" page for more information about supported 4 x 5 cm SoMs.
Key Features
- 3 x Samtec LSHM Series Board to Board Connectors
- VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL IO-bank pins
- SDIO port expander with voltage-level translation
- Micro SD card socket
- USB 2.0 type A connector, optionally Micro USB 2.0 connector (OTG-mode)
- 1 x user-push button S2, by default configured as system reset button
- 1 x RJ45 Gigabit Ethernet MagJack J3, connected via MDI to B2B connector JB1
- 1 x Marvell Alaska 88E1512 Ethernet PHY, providing Ethernet interface with RJ45 Gigabit Ethernet MagJack J2
- 5V power supply barrel jack
- 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
- JTAG- / UART-interface (12-pin header JX1)
- DIP-switch S1 to set System Controller CPLD signals on SoM
- 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's bank voltages
Block Diagram
Figure 1: TE0706-02 Block Diagram
Main Components
Figure 2: TE0706-02 Carrier Board
- 5V power connector jack, J1
- Reset switch, S2
- USB type A receptacle, J7
- Micro SD card socket with Card Detect, J4
- 50 pin IDC male connector, J5
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
- JTAG- / UART-connector, JX1
- User DIP-switch, S1
- VCCIO voltage selection jumper block, J10 - J12
- External connector (VG96) placeholder, J6
- Samtec Razor Beam™ LSHM-150 B2B connector, JB1
- Samtec Razor Beam™ LSHM-150 B2B connector, JB2
- Samtec Razor Beam™ LSHM-130 B2B connector, JB3
Initial Delivery State
Board is shipped in following configuration:
- VCCIO voltage selection jumpers are all set to 1.8 V.
- S2 switch configured as reset button.
- One VG96 connector is not soldered to the board, but is included in the package as separate component.
Different delivery configurations are available upon request.
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
For detailed information about the B2B pin out, please refer to the Master Pin-out Table.
JTAG/UART Interface
JTAG access to the mounted 4 x 5 SoM is provided via 12-pin header JX1 and controlled by DIP switch S1-2 to select the device to program (see section 'DIP Switch S1').
This header has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment, so the XMOD-FT2232H adapter-board TE0790 can be used in conjunction with the TE0706 carrier board to program the mounted SoM via USB interface.
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Table 1: JTAG- / UART-header JX1 pin-assignment
Micro SD Card Socket
Micro SD Card socket is not directly wired to the B2B connector pins, but routed through a Texas Instruments TXS02612 SDIO port expander, which is needed for voltage translation due to the different voltage levels of the Micro SD Card and MIO bank 501 of the Xilinx Zynq 7000 chip. The Micro SD Card has 3.3 V signal voltage-level, but the MIO Bank 501 on the Xilinx Zynq 7000 chip is set to 1.8 V.
Ethernet
The TE0706-02 is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet interface. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied by on-board 25MHz oscillator (U7).
PHY (U6) interface pin assignment:
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JB3-47,
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Reduced Gigabit Media Independent Interface.
12 pins.
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Serial Gigabit Media Independent Interface.
Not connected.
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Media Dependent Interface.
Connected to Gigabit Ethernet MagJack J2.
Table 2: Ethernet PHY interface connections
RJ45 Gigabit Ethernet MagJack J3
The TE0706-02 carrier board is also equipped with a second Gigabit-Ethernet MagJack J3, which is connected via MDI to the B2B connector JB1.
There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.
USB Interface
TE0706-02 board has one physical USB type A socket J7 routed to B2B connector JB3. The corresponding USB-transceiver on 4 x 5 SoMs varies in order of the used SoM model.
There is also the option to equip a Micro USB 2.0 type B receptacle socket (J8) to the board as alternative.
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Note: Pin OTG-ID is only assigned to USB 2.0 type B socket. |
DIP-Switch S1
Figure 2: User DIP Switch S1
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Boot mode configuration, if supported by SoM. (Depends also on SoM's SC-CPLD firmware).
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Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware).
Note: Power-on sequence will be intermitted if S1-4 is set to OFF and if functionality is supported by SoM.
Table 3: Functionality of the states of DIP-switch S1
Connector J5 and J6
On the TE0706-02 carrier board there is one 50-pin IDC male connector socket J5 and a place-holder (VG96-Connector solder pads) J6 to provides access to SoM's PL IO-bank-pins. With this user interfaces, a large quantity of IO's are also usable as LVDS-pairs and different VCCIO's are available to operate the IO's properly.
Following table gives a summary of the optional pin-headers of the base-board:
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3.3V,
M3.3VOUT (from mounted module)
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LEDs of MagJack J2,
MIO0,MIO9...MIO15 of the Zynq module
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VG96-Connector
place holder
(solder pads)
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3.3V,
M3.3VOUT (from mounted module),
5VIN,
VCCIOA,
VCCIOC
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Table 4: Pin-assignment of connector J5 and J6
Power and Power-On Sequence
Power supply with minimum current capability of 3A for system startup is recommended.
Power Supply
TE0706-02 needs one single power supply with nominal of 5V.
Power Consumption
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The power-consumption of TE0706-02 in conjunction with different 4 x 5 SoMs under certain configurations are depending on the used model of the 4 x 5 SoM and the custom-made FPGA-design on this SoM. Please refer to the TRM of the mounted 4 x 5 SoM to get information about the typical power consumption.
Power-On Sequence
It is not allowed to feed any voltage to any external I/O pin before there is no power indication on M3.3VOUT pins. Presence of 3.3V on B2B JB2 connector pins 9 and 11 indicates that module is properly powered up and ready. The 1.8V voltage-level on base-board for supplying PL I/O bank supply-voltages will be powered up after the module's 3.3V voltage-level has reached stable state and M3.3VOUT is available on the B2B-connector JB2, pins 9 and 11.
Figure 3: TE0706-02 power-up sequence diagram.
Base-board supply-voltage configuration
Refer to the 4 x 5 Module Integration Guide for VCCIO voltage options.
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Note: The corresponding PL I/O bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model. Refer to the SoM's schematic for information about the specific pin assignments on module's B2B-connectors regarding the PL I/O bank supply-voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options. |
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Following table shows how to configure the voltage-levels of base-board supply-voltages VCCIOA, VCCIOB and VCCIOC by jumper, 0-Ohm-resistor or by feeding the supply voltage through connector J6:
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Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.
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Take care of the VCCO voltage ranges of the particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges. It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM. |
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Header J9 exposes the SoM's VBAT-pin to an accessible connector. Please refer to the SoM's documentation regarding the operation conditions of this pin. |
Technical Specifications
Absolute Maximum Ratings
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Parameter
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Units
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Supply voltage VIN
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V
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TPS2051DGN power distribution switch
Note: USB-VBUS = VIN, if enabled.
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Storage temperature
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-55
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+85
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°C
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Recommended Operating Conditions
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Parameter
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Units
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Supply Voltage Vin
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4.75
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5.25
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V
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0
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+70
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°C
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Please check components datasheets for complete list of absolute maximum and recommended operating ratings. |
Physical Dimensions
Board size: PCB 100mm × 64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.
Mating height of the module with standard connectors: 8mm
PCB thickness: 1.65mm
Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Industrial grade: -40°C to +85°C.
Board operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Weight
115g - Plain baseboard.
13g - VG96 connector.
Revision History
Hardware Revision History
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Revision
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Notes
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PCN
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02
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First production revision
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01
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Prototypes
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Hardware revision number is printed on the PCB board next to the module model number separated by the dash.
Document Change History
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Date
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Revision
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Contributors
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Description
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Disclaimer
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