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Table of Contents
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Overview
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Refer to https://wiki.trenz-electronic.de/display/PD/TE0706+TRM for the current online version of this manual and other available documentation.
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The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.
See "4 x 5 SoMs - Carriers" page for more information about supported 4 x 5 cm SoMs.
Key Features
- 3 x Samtec LSHM Series Board to Board Connectors
- VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
- Micro SD card socket
- SDIO port expander with voltage-level translation
- USB2.0 type A connector, optionally Micro USB 2.0 connector
- 1 x user-push button S2, by default configured as system reset button
- 1 x RJ45 GbE MagJack J3, connected via MDI to B2B connector JB1
- 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack J2
- 5V power supply barrel jack
- 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
- XMOD JTAG- / UART-header JX1
- DIP-switch S1 to set Som's System Controller CPLD control signals
- 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
Figure 1: TE0706-02 block diagram.
Main Components
Figure 2: TE0706-02 Carrier Board
- 5V power connector jack, J1
- Reset switch, S2
- USB2.0 type A receptacle, J7
- Micro SD card socket with Card Detect, J4
- 50 pin IDC male connector, J5
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
- XMOD JTAG- / UART-header, JX1
- User DIP-switch, S1
- VCCIO selection jumper block, J10 - J12
- External connector (VG96) placeholder, J6
- Samtec Razor Beam™ LSHM-150 B2B connector, JB1
- Samtec Razor Beam™ LSHM-150 B2B connector, JB2
- Samtec Razor Beam™ LSHM-130 B2B connector, JB3
Initial Delivery State
Board is shipped in following configuration:
- VCCIO voltage selection jumpers are all set to 1.8 V.
- S2 switch configured as reset button.
- One VG96 connector (not soldered to the board, but included in the package as separate component)
Different delivery configurations are available upon request.
Signals, Interfaces and Pins
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B2B Connector
With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/O's are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/O's properly.
Following table gives a summary of the available I/O's, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:
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Table 1: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.
On-board Connector
The TE0706 Carrier Board has and a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/O's are available to the user, a large quantity of these I/O's are also usable as differential pairs.
Following table gives a summary of the pin-assignment, available interfaces and functional I/O's of the connectors J5 and J6:
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User I/O
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Table 2: General overview of PL I/O signals, SoM's interfaces and control signals connected to the on-board connectors.
JTAG Interface
JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JX1. With the TE0790 XMOD USB2.0 to JTAG adapter, the device of the mounted SoM can be programed via USB2.0 interface.
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JTAG Signal
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B2B Connector Pin
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Table 3: JTAG interface signals.
UART Interface
UART interface is available on B2B connector JB1 and is usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals:
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Table 4: UART interface signals.
I²C Interface
One of the SoM's I²C interface is routed to the on-board connector J5 and is available to the user for general purposes:
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Table 5: I²C interface signals.
SD IO Interface
The SD IO interface of the mounted SoM is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V):
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Table 6: SD IO interface signals.
USB2.0 Interface
TE0706-02 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.
There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.
For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.
Following table gives an overview of the USB2.0 interface signals:
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JB2-48
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Table 7: USB2.0 interface signals and connections.
Gigabit Ethernet Interface
The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied by on-board 25MHz oscillator (U7).
The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY.
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JB3-47,
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Reduced Gigabit Media Independent Interface.
12 pins.
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Serial Gigabit Media Independent Interface.
Not connected.
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Media Dependent Interface.
Connected to Gigabit Ethernet MagJack J2.
Table 8: GbE interface signals and connections.
RJ45 Gigabit Ethernet MagJack J3
The TE0706-02 carrier board is also equipped with a second Gigabit-Ethernet MagJack J3, which is connected via MDI to the B2B connector JB1.
There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.
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JB1-3
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Table 9: RJ45 GbE MagJack signals and connections.
XMOD FTDI JTAG-Adapter Header
The JTAG interface of the mounted SoM can be accessed via XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. So in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM can be programmed via USB2.0 interface. The TE0790 board provides also an UART interface to the SoM's Zynq device which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted.
Following table describes the signals and interfaces of the XMOD header JX1:
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Table 10: XMOD header signals and connections.
When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCC and VCCIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:
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Use Xilinx compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx Zynq devices. The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download. |
On-board Peripherals
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4-bit DIP-switch
Table below describes DIP-switch S1 settings for configuration of the mounted SoM:
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Boot mode configuration, if supported by SoM. (Depends also on SoM's SC-CPLD firmware).
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Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware).
Note: Power-on sequence will be intermitted if S1-4 is set to OFF and if functionality is supported by SoM.
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Table of Contents
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Overview
The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.
See "4 x 5 SoM Carriers" page for more information about supported 4 x 5 cm SoMs.
Refer to http://trenz.org/te0706-info for the current online version of this manual and other available documentation.
Key Features
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- 3 x Samtec LSHM Series Board to Board Connectors
- VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
- USB2.0 type A connector, or optionally Micro USB 2.0 connector
- 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
- 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
- 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
- XMOD JTAG- / UART-header JX1
- Micro SD card socket
- SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
- DIP-switches S1 to set SoM's control signals
- 1 x user-push button (S2), by default configured as system reset button
- 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
- 5V power supply barrel jack
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
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Main Components
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- 5V power connector jack, J1
- Reset switch, S2
- USB2.0 type A receptacle, J7
- Micro SD card socket with Card Detect, J4
- 50 pin IDC male connector, J5
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
- 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
- XMOD JTAG- / UART-header, JX1
- User DIP-switch, S1
- VCCIO selection jumper block, J10 - J12
- External connector (VG96) placeholder, J6
- Samtec Razor Beam™ LSHM-150 B2B connector, JB1
- Samtec Razor Beam™ LSHM-150 B2B connector, JB2
- Samtec Razor Beam™ LSHM-130 B2B connector, JB3
- SoM SDIO voltage selection jumper, J13
Initial Delivery State
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Notes : Only components like EEPROM, QSPI flash and DDR3 can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
There is no hardware component to be programmed on the carrier.
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Board is shipped in following configuration:
- VCCIO voltage selection jumpers are all set to 1.8 V.
- S2 switch configured as reset button.
Different delivery configurations are available upon request.
Configuration Signals
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There is a user push button which is used for RESET signal.
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Signals, Interfaces and Pins
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Board to Board (B2B) I/Os
With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/Os are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/Os properly.
Following table gives a summary of the available I/Os, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:
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On-board Connector
The TE0706 Carrier Board has a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/Os are available to the user, a large quantity of these I/Os are also usable as differential pairs.
Following table gives a summary of the pin-assignment, available interfaces and functional I/Os of the connectors J5 and J6:
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JTAG/UART Interface Base
JTAG/UART access to the TE0706 carrier is available through XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. This header provides also a UART interface, usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. XMOD USB2.0 to JTAG/UART adapter TE0790 is provided by Trenz Electronic. More information is available here. Devices of the mounted SoM can be programed via USB2.0 interface.
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When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:
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Use AMD compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the AMD Zynq devices. The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download. |
SD Card Socket
The SD Socket is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V/3.3V depending on Module, compare jumper J13 ):
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USB2.0 connector
TE0706-03 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.
There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.
For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.
Following table gives an overview of the USB2.0 connector signals:
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RJ45 Gigabit Ethernet Connectors
The TE0706 Carrier Board is equipped with two Gigabit Ethernet ports. One of them (J2) is routed to Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6). The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY. The MegJack J3 is connected via MDI directly to the B2B connector JB1. There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.
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MIO Pins
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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic. Example:
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On-board Peripherals
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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4-bit DIP-switch
Table below describes DIP-switch S1 settings for configuration of the mounted SoM:
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Note: Compared to the former revision 02 of this board, the DIP-switch is rotated by 180° due to routing issues. |
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VCC Selection Jumpers
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Note: The corresponding PL I/O-bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model. Refer to the SoM's schematic for information about the specific pin assignments on module's B2B-connectors regarding the PL I/O-bank supply-voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options. |
The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.
Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:
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Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.
Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.
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Take care of the VCCO voltage ranges of the particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges. It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM. |
The SDIO voltage on the SoM side can be selected by jumper J13.
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RTC Buffer Voltage Supply Header
The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.
Push Button
The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.
Gigabit Ethernet PHY
The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. The I/O Voltage is fixed at 1.8V. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.
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SDIO Port Expander
The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the AMD Zynq module has VCCIO of 1.8V or 3.3V depending on the attached module. This has to be selected by J13.
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Power and Power-On Sequence
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
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Power Supply
Power supply with minimum current capability of 3A for system startup is recommended.
Power Consumption
The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.
AMD provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
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* TBD - To Be Determined.
Power supply with minimum current capability of 3A for system startup is recommended.
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To avoid any damage to the module, check for stabilized on-board voltages and VCCIOs before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence. |
Power Distribution Dependencies
The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:
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Power Rails
The voltage direction of the power rails is directed at on-board connectors' view:
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Board to Board Connectors
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Technical Specifications
Absolute Maximum Ratings
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range (-40 °C ..+85 °C).
Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.
Physical Dimensions
Board size: PCB 100mm × 64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.
Mating height of the module with standard connectors: 8mm
PCB thickness: 1.65mm
Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.
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In 'Physical Dimension' section, top and button view of module must be insterted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part)for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:
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All dimensions are given in millimeters.
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Currently Offered Variants
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Set correct link to the shop page overview table of the product on English and German. Example for TE0728: ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ if not available, set. |
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Revision History
Hardware Revision History
List of online PCNs can be found here.
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Document Change History
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Figure 3: User DIP-switch S1
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Note |
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Note: The corresponding PL I/O-bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model. Refer to the SoM's schematic for information about the specific pin assignments on module's B2B-connectors regarding the PL I/O-bank supply-voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options. |
The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.
Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:
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Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.
Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.
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Take care of the VCCO voltage ranges of the particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges. It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM. |
RTC Buffer Voltage Supply Header
The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.
Push Button
The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.
Gigabit Ethernet PHY
On-board Gigabit Ethernet PHY (U6) is provided with Marvell Alaska 88E1512. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.
SDIO Port Expander
The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the Xilinx Zynq module has VCCIO of 1.8V.
Power and Power-On Sequence
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Power Consumption
The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
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Table 14: Typical power consumption.
* TBD - To Be Determined soon with reference design setup.
Power supply with minimum current capability of 3A for system startup is recommended.
Warning |
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To avoid any damage to the module, check for stabilized on-board voltages and VCCIO's before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence. |
Power Distribution Dependencies
The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:
Figure 5: Board power distribution diagram.
Power Rails
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3.3V
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2, 4, 6, 14, 16
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1.8V
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2, 4
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Table 15: Power pin description of B2B module connector.
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3.3V
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6, 45
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VCCIOA
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B32
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Table 16: Power Pin description of on-board connector.
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VCCIOB
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Table 17: Power Pin description of VCCIO selection jumper pin header.
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1
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Table 18: Main Power jack and pins description.
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Table 19: Power pin description of peripheral connector.
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Table 20: Power pin description of XMOD/JTAG Connector.
Board to Board Connectors
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Variants Currently In Production
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Operating Temperature
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Table 21: Board variants.
Technical Specifications
Absolute Maximum Ratings
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Parameter
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Units
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Reference Document
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5VIN supply voltage
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V
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Storage temperature
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-55
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°C
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Table 22: Module absolute maximum ratings.
Recommended Operating Conditions
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Table 23: Module recommended operating conditions.
Operating Temperature Ranges
Industrial grade: -40°C to +85°C.
The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range.
Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.
Physical Dimensions
Board size: PCB 100mm × 64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.
Mating height of the module with standard connectors: 8mm
PCB thickness: 1.65mm
Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Figure 6: Board physical dimensions drawing.
Revision History
Hardware Revision History
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Notes
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01
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- Prototypes
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- First Production Release
- Refer to Changes list in Schematic
for further details in changes to REV01
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Table 24: Module hardware revision history.
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Figure 7: Board hardware revision number.
Document Change History
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Date
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Revision
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Contributors
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Description
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Disclaimer
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