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Template Revision 2.0 - on construction TRM Name always "TE Series Name" +TRM, for example "TE0720 TRM" |
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Table of Contents
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Overview
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The Trenz Electronic TEC0850 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, with 64-bit wide SODIMM DDR4 SDRAM, max. Dual 512 MByte Flash memory for configuration and operation. 24 Gigabit transceivers on PL side and 4 PS side. Powerful switch-mode power supplies for all onboard voltages. A large number of configurable I/Os. 3U form factor.
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Refer to http://trenz.org/tec0850-info for the current online version of this manual and other available documentation.
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Key Features
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Block Diagram
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Main Components
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Initial Delivery State
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Control Signals
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Signals, Interfaces and Pins
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Subsections...
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Table of Contents
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Overview
The Trenz Electronic TEC0850 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, with 64-bit wide SODIMM DDR4 SDRAM, max. Dual 512 MByte Flash memory for configuration and operation. 24 Gigabit transceivers on PL side and 4 PS side. Powerful switch-mode power supplies for all onboard voltages. A large number of configurable I/Os. 3U form factor.
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Refer to http://trenz.org/tec0850-info for the current online version of this manual and other available documentation.
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Key Features
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Block Diagram
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title | Figure 1: TEC0850-02 block diagram |
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Main Components
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Initial Delivery State
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Boot Process
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The Zynq UltraScale+ DDRC hard memory controller is wired to the DDR4 SODIMM Socket U3.
Circular Push Pull Connector
PicoBlade Connector
Pin Heater 2,54mm (2x5)
Battery holder
On-board Peripherals
Zynq UltraScale XCZU15EG MPSoC
The TEC0850 board is populated with the Zynq UltraScale+ XCZU15EG-1FFVB1156E MPSoC.
Main IO interfaces are shown on the image below.
PS MIO Configuration
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the DDR4 SODIMM Socket U3.
Circular Push Pull Connector
PicoBlade Connector
Pin Heater 2,54mm (2x5)
Battery holder
On-board Peripherals
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Zynq UltraScale XCZU15EG MPSoC
The TEC0850 board is populated with the Zynq UltraScale+ XCZU15EG-1FFVB1156E MPSoC.
Main IO interfaces are shown on the image below.
PS MIO Configuration
MIO | Interface |
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MIO 0...12 | QSPI Flash Memory |
MIO 20...21 | I2C 1 |
MIO 22...23 | UART 0 |
MIO 26...37 | GEM 0 |
MIO 46...51 | SD 1 |
MIO 52...63 | USB 0 |
MIO 64...75 | USB 1 |
MIO 76...77 | MDIO 0 |
Table 10: Default MIO Configuration
MAX10 System Controller
System controller chip is Intel MAX10 10M08SAU169C8G Chip with board control firmware.
Programmable Clock Generators
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I2C
The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.
I2C address | Chip | Description |
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0x69 | U14 Si5345 | Clock generator and distributor |
Oscillators
FTDIs
FT2232H
FT601Q-B-T
Quad-SPI Flash Memory
Board has two N25Q512A11G1240E connected in a dual parallel mode.
EEPROMs
I2C
The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.
I2C address | Chip | Description |
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0x50 | U63 24AA128T-I/ST | 128K Serial EEPROM |
0x53 | U64 24AA025E48T-I/OT | 2K Serial EEPROM with EUI-48™ or EUI-64™ Node Identity |
USB PHY
Gigabit Ethernet PHY
Board has Marvell Alaska 88E1512 Ethernet PHY which use MDIO address 1.
8Bit DACs
Board has 4 8-bit parallel Texas Instruments THS5641 DACs with up to 100 MSPS Update Rate.
DIP-Switches
S1
Switch | Description |
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1 | Boot Mode 0 |
2 | Boot Mode 1 |
3 | Boot Mode 2 |
4 | Boot Mode 3 |
See Zynq UltraScale+ Device Technical Reference Manual page 236 for full boot modes description. Most common modes are
Boot Mode | SW1:4 | SW1:3 | SW1:2 | SW1:1 |
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JTAG Boot Mode | ON | ON | ON | ON |
Quad-SPI | ON | ON | ON | OFF |
SD Card | ON | ON | OFF | OFF |
S2
Switch | Description |
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1 | SC JTAGEN |
2 | EEPROM WP (Write protect) |
3 | FPGA PUDC |
4 | SC Switch (Reserved for future use) |
Buttons
LEDs
LED | Signal | Chip | Pin | Description |
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Front panel LED 1 (Red) | LED_FP_1 | FPGA U1 | AF15 | PL User defined LED |
Front panel LED 2 (Green) | LED_FP_2 | FPGA U1 | AG15 | PL User defined LED |
Front panel LED 3 (Green) | LED_FP_3 | FPGA U1 | AE15 | PL User defined LED |
Front panel LED 4 (Green) | LED_FP_4 | SC U18 | M4 | Power Good |
Power and Power-On Sequence
Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
Power Input | Typical Current |
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TBD* |
Table : Typical power consumption.
Power Distribution Dependencies
Table 10: Default MIO Configuration
MAX10 System Controller
System controller chip is Intel MAX10 10M08SAU169C8G Chip with board control firmware.
Programmable Clock Generators
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title | Figure 2: TEF1001-02 main components |
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I2C
The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.
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Oscillators
FTDIs
FT2232H
FT601Q-B-T
Quad-SPI Flash Memory
Board has two N25Q512A11G1240E connected in a dual parallel mode.
EEPROMs
I2C
The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.
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USB PHY
Gigabit Ethernet PHY
Board has Marvell Alaska 88E1512 Ethernet PHY which use MDIO address 1.
8Bit DACs
Board has 4 8-bit parallel Texas Instruments THS5641 DACs with up to 100 MSPS Update Rate.
DIP-Switches
S1
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See Zynq UltraScale+ Device Technical Reference Manual page 236 for full boot modes description. Most common modes are
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S2
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Buttons
LEDs
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Power and Power-On Sequence
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Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
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Table : Typical power consumption.
Power Distribution Dependencies
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title | Figure 3: Power Distribution |
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Power-On Sequence
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Power Rails
Bank Voltages
Variants Currently In Production
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Voltage Monitor Circuit
Power Rails
Bank Voltages
Technical Specifications
Absolute Maximum Ratings
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Recommended Operating Conditions
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Technical Specifications
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supply voltage...
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Storage temperature
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°C
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Table : Module absolute maximum ratings.
Recommended Operating Conditions
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Table : Module recommended operating conditions.
Physical Dimensions
Board size: ...mm × ...mm. Please download the assembly diagram for exact numbers
PCB thickness: ca. ...mm
The board meets the ... Specification...
All dimensions are given in millimeters.
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Physical Dimensions
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Variants Currently In Production
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Revision History
Hardware Revision History
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01
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First production release
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Table 24: Module hardware revision history
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Document Change History
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Document Change History
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Table 25: Document change history
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Disclaimer
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