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Template Revision 2.0 - on construction

TRM Name always "TE Series Name" +TRM, for example "TE0720 TRM"

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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

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-----------------------------------------------------------------------

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Note for Download Link of the Scroll ignore macro:

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Download PDF version of this document.

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Table of Contents

Table of Contents

Overview

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Notes :

The Trenz Electronic TEC0850 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, with 64-bit wide SODIMM DDR4 SDRAM, max. Dual 512 MByte Flash memory for configuration and operation. 24 Gigabit transceivers on PL side and 4 PS side. Powerful switch-mode power supplies for all onboard voltages. A large number of configurable I/Os. 3U form factor.

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Refer to http://trenz.org/tec0850-info for the current online version of this manual and other available documentation.

Key Features

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Notes:

  • List of key features of the PCB
  • ...

  • ...

  • ...

Block Diagram

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titleFigure 1: TEC0850-02 block diagram
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Main Components

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  • Picture of the PCB (top and bottom side) with labels of important components
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titleFigure 2: TEC0850-02 main components
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  1. ...
  2. ...
  3. ...

Initial Delivery State

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titleTable 1: Initial delivery state of programmable devices on the module.

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Storage device name

Content

Notes

..

..

..
OTP Flash areaEmptyNot programmed.

Control Signals

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  • Overview of Boot Mode, Reset, Enables,

Signals, Interfaces and Pins

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Notes :

  • For carrier or stand-alone boards use subsection for every connector typ (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier us only classes and refer to B2B connector if more than one is used, for example
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    • UART
    • I2C
    • MGT
    • ...

Subsections...

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Table of Contents

Table of Contents

Overview

The Trenz Electronic TEC0850 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, with 64-bit wide SODIMM DDR4 SDRAM, max. Dual 512 MByte Flash memory for configuration and operation. 24 Gigabit transceivers on PL side and 4 PS side. Powerful switch-mode power supplies for all onboard voltages. A large number of configurable I/Os. 3U form factor.

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Refer to http://trenz.org/tec0850-info for the current online version of this manual and other available documentation.

Key Features

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Block Diagram

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Main Components

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  1. ...
  2. ...

Initial Delivery State

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Boot Process

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The Zynq UltraScale+ DDRC hard memory controller is wired to the DDR4 SODIMM Socket U3.

Circular Push Pull Connector

PicoBlade Connector

Pin Heater 2,54mm (2x5)

Battery holder

On-board Peripherals

Zynq UltraScale XCZU15EG MPSoC

The TEC0850 board is populated with the Zynq UltraScale+ XCZU15EG-1FFVB1156E MPSoC.

Main IO interfaces are shown on the image below.

PS MIO Configuration

...

the DDR4 SODIMM Socket U3.

Circular Push Pull Connector

PicoBlade Connector

Pin Heater 2,54mm (2x5)

Battery holder

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Ethernet PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

Subsections...


Zynq UltraScale XCZU15EG MPSoC

The TEC0850 board is populated with the Zynq UltraScale+ XCZU15EG-1FFVB1156E MPSoC.

Main IO interfaces are shown on the image below.


PS MIO Configuration

MIOInterface
MIO 0...12QSPI Flash Memory
MIO 20...21I2C 1
MIO 22...23UART 0
MIO 26...37GEM 0
MIO 46...51SD 1
MIO 52...63USB 0
MIO 64...75USB 1
MIO 76...77MDIO 0

Table 10: Default MIO Configuration

MAX10 System Controller

System controller chip is Intel MAX10 10M08SAU169C8G Chip with board control firmware.


Programmable Clock Generators

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I2C

The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.

I2C addressChipDescription
0x69U14 Si5345Clock generator and distributor

Oscillators

FTDIs

FT2232H

FT601Q-B-T

Quad-SPI Flash Memory

Board has two N25Q512A11G1240E connected in a dual parallel mode.

EEPROMs

I2C

The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.

I2C addressChipDescription
0x50U63 24AA128T-I/ST128K Serial EEPROM
0x53U64 24AA025E48T-I/OT2K Serial EEPROM with EUI-48™ or EUI-64™ Node Identity

USB PHY

Gigabit Ethernet PHY

Board has Marvell Alaska 88E1512 Ethernet PHY which use MDIO address 1.


8Bit DACs

Board has 4 8-bit parallel Texas Instruments THS5641 DACs with up to 100 MSPS Update Rate. 


DIP-Switches

S1

SwitchDescription
1Boot Mode 0
2Boot Mode 1
3Boot Mode 2
4Boot Mode 3

See Zynq UltraScale+ Device Technical Reference Manual page 236 for full boot modes description. Most common modes are

Boot ModeSW1:4SW1:3SW1:2SW1:1
JTAG Boot ModeONONONON
Quad-SPIONONONOFF
SD CardONONOFFOFF

S2

SwitchDescription
1SC JTAGEN
2EEPROM WP (Write protect)
3FPGA PUDC
4SC Switch (Reserved for future use)


Buttons

LEDs

LEDSignalChipPinDescription
Front panel LED 1 (Red)LED_FP_1FPGA U1AF15PL User defined LED
Front panel LED 2 (Green)LED_FP_2FPGA U1AG15PL User defined LED
Front panel LED 3 (Green)LED_FP_3FPGA U1AE15PL User defined LED
Front panel LED 4 (Green)LED_FP_4SC U18M4Power Good


Power and Power-On Sequence

Power Consumption

The maximum power consumption of a module mainly depends on the design running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current

TBD*

Table : Typical power consumption.

Power Distribution Dependencies

Table 10: Default MIO Configuration

MAX10 System Controller

System controller chip is Intel MAX10 10M08SAU169C8G Chip with board control firmware.

Programmable Clock Generators

...

anchorFigure_2
titleFigure 2: TEF1001-02 main components

...

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I2C

The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.

...

Oscillators

FTDIs

FT2232H

FT601Q-B-T

Quad-SPI Flash Memory

Board has two N25Q512A11G1240E connected in a dual parallel mode.

EEPROMs

I2C

The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.

...

USB PHY

Gigabit Ethernet PHY

Board has Marvell Alaska 88E1512 Ethernet PHY which use MDIO address 1.

8Bit DACs

Board has 4 8-bit parallel Texas Instruments THS5641 DACs with up to 100 MSPS Update Rate. 

DIP-Switches

S1

...

See Zynq UltraScale+ Device Technical Reference Manual page 236 for full boot modes description. Most common modes are

...

S2

...

Buttons

LEDs

...

Power and Power-On Sequence

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Power Consumption

The maximum power consumption of a module mainly depends on the design running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

...

Table : Typical power consumption.

Power Distribution Dependencies

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titleFigure 3: Power Distribution

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titleFigure 43: Power -On Sequence DiagramDistribution
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Power-On Sequence

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Power Rails

Bank Voltages

Variants Currently In Production

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Voltage Monitor Circuit

Power Rails

Bank Voltages

Technical Specifications

Absolute Maximum Ratings

Scroll Title
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titleTable x: Module absolute maximum ratings.
ParameterMinMaxUnitsReference Document










Recommended Operating Conditions

Scroll Title
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titleTable x: Module absolute maximum ratings.
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Technical Specifications

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ParameterMinMaxUnitsReference Document

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supply voltage...

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V

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Storage temperature

...

°C

...

Table : Module absolute maximum ratings.

Recommended Operating Conditions

...

Table : Module recommended operating conditions.

Physical Dimensions

  • Board size: ...mm × ...mm. Please download the assembly diagram for exact numbers

  • PCB thickness: ca. ...mm

  • The board meets the ... Specification...

All dimensions are given in millimeters.

...











Physical Dimensions

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Variants Currently In Production

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Trenz shop TE0xxx overview page
English pageGerman page

...

Revision History

Hardware Revision History

...

Scroll Title

...

anchor

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Table_x

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01

...

First production release

...

Table 24: Module hardware revision history

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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titleFigure 6: Module hardware revision number
titleTable x: Module absolute maximum ratings.

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DateRevision

Notes

PCNDocumentation Link
-

01

Prototypes








Document Change History

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  • Note this list must be only updated, if the document is online on public doc!
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Constributor

Document Change History

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Table 25: Document change history

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  • change list
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