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Overview


Design Example with minimum PS Setup (DDR, QSPI, UART0) only for custom boards or easier debug via Vitis.

Refer to http://trenz.org/te0808-info for the current online version of this manual and other available documentation.

Key Features

  • Vitis/Vivado 2021.2
  • QSPI
  • Custom Carrier (minimum PS Design with available module components only)
  • Modified FSBL (some additional outputs only)

Revision History

DateVivadoProject BuiltAuthorsDescription
2022-03-212021.2TE0808-test_board-vivado_2021.2-build_11_20220321063547.zip
TE0808-test_board_noprebuilt-vivado_2021.2-build_11_20220321063547.zip
John Hartfiel
  • replace Starterkit FSBL with default one
2022-03-162021.2TE0808-test_board-vivado_2021.2-build_11_20220316091917.zip
TE0808-test_board_noprebuilt-vivado_2021.2-build_11_20220316091917.zip
Manuela Strücker
  • 2021.2 release
  • update board files
2021-05-122020.2TE0808-test_board-vivado_2020.2-build_5_20210512133121.zip
TE0808-test_board_noprebuilt-vivado_2020.2-build_5_20210512133137.zip
John Hartfiel
  • update board files
2021-02-052020.2TE0808-test_board-vivado_2020.2-build_0_20210204141911.zip
TE0808-test_board_noprebuilt-vivado_2020.2-build_1_20210204142855.zip
John Hartfiel
  • 2020.2 update
2020-09-292019.2TE0808-test_board_noprebuilt-vivado_2019.2-build_15_20200929070740.zip
TE0808-test_board-vivado_2019.2-build_15_20200929070725
John Hartfiel
  • bugfix 8GB board parts
2020-09-222019.2TE0808-test_board_noprebuilt-vivado_2019.2-build_14_20200922073159.zip
TE0808-test_board-vivado_2019.2-build_14_20200922073144.zip
John Hartfiel
  • new assembly variants
2020-03-252019.2TE0808-test_board_noprebuilt-vivado_2019.2-build_8_20200325083246.zip
TE0808-test_board-vivado_2019.2-build_8_20200325083204.zip
John Hartfiel
  • script update
2020-01-222019.2TE0808-test_board_noprebuilt-vivado_2019.2-build_3_20200122142231.zip
TE0808-test_board-vivado_2019.2-build_3_20200122142208.zip
John Hartfiel
  • 2019.2 update
  • Vitis support
2019-08-092018.3TE0808-test_board_noprebuilt-vivado_2018.3-build_07_20190809131546.zip
TE0808-test_board-vivado_2018.3-build_07_20190809131522.zip
John Hartfiel
  • new assembly variants
2019-05-062018.3TE0808-test_board_noprebuilt-vivado_2018.3-build_05_20190507124141.zip
TE0808-test_board-vivado_2018.3-build_05_20190507124130.zip
John Hartfiel
  • custom FSBL
2018-07-112018.2TE0808-test_board_noprebuilt-vivado_2018.2-build_02_20180711143743.zip
TE0808-test_board-vivado_2018.2-build_02_20180711143702.zip
John Hartfiel
  • additional notes for FSBL generated with Win SDK
  • changed *.bif
2018-03-292017.4TE0808-test_board-vivado_2017.4-build_07_20180329151341.zip
TE0808-test_board_noprebuilt-vivado_2017.4-build_07_20180329151355.zip
John Hartfiel
  • new assembly variant
2018-01-162017.4TE0808-test_board-vivado_2017.4-build_04_20180116144644.zip
TE0808-test_board_noprebuilt-vivado_2017.4-build_04_20180116144657.zip
John Hartfiel
  • Update Board Part for TEBF0808
    • no changes for test board design and minimal board parts
2018-01-152017.4TE0808-test_board-vivado_2017.4-build_03_20180115084954.zip
TE0808-test_board_noprebuilt-vivado_2017.4-build_03_20180115085020.zip
John Hartfiel
  • rework Board Part Files
2017-12-202017.2

TE0808-test_board-vivado_2017.2-build_07_20171220192501.zip
TE0808-test_board_noprebuilt-vivado_2017.2-build_07_20171220192448.zip

John Hartfiel
  • Update Board Part Files
2017-11-222017.2TE0808-test_board-vivado_2017.2-build_05_20171122080211.zip
TE0808-test_board_noprebuilt-vivado_2017.2-build_05_20171122080228.zip
John Hartfiel
  • Update Board Part CSV File
  • Regenerate design
2017-11-162017.2

TE0808-test_board-vivado_2017.2-build_05_20171116151545.zip
TE0808-test_board_noprebuilt-vivado_2017.2-build_05_20171116151600.zip

John Hartfiel
  • Update Board Part CSV File with new Flash assembly variants
2017-11-132017.2TE0808-test_board-vivado_2017.2-build_05_20171113140954.zip
TE0808-test_board_noprebuilt-vivado_2017.2-build_05_20171113141908.zip
John Hartfiel
  • initial release
Design Revision History

Release Notes and Know Issues

IssuesDescriptionWorkaroundTo be fixed version
QSPI FlashFlash programming is not supported with boot mode QSPI or SD.
If flash programming fails, configure device for JTAG boot mode and try again or use older Vivado Versions for programming. (Vivado 2020.2 or 2019.2)
--
Known Issues

Requirements

Software

SoftwareVersionNote
Vitis2021.2needed, Vivado is included into Vitis installation
Software

Hardware

Basic description of TE Board Part Files is available on TE Board Part Files.

Complete List is available on "<project folder>\board_files\*_board_files.csv"

Design supports following modules:

Module ModelBoard Part Short NamePCB Revision SupportDDRQSPI FlashEMMCOthersNotes
TE0808-ES1          es1_2gb      REV03|REV02 2GB      64MB       NA         NA               Not longer supported by vivado       
TE0808-ES2          es2_2gb      REV04|REV03 2GB      64MB       NA         NA               Not longer supported by vivado                    
TE0808-2ES2         2es2_2gb     REV04|REV03 2GB      64MB       NA         NA               Not longer supported by vivado             
TE0808-04-09EG-1EA  9eg_1e_2gb   REV04       2GB      64MB       NA         NA               NA                                     
TE0808-04-09EG-1EB  9eg_1e_4gb   REV04       4GB      64MB       NA         NA               NA                                     
TE0808-04-09EG-1ED  9eg_1e_4gb   REV04       4GB      64MB       NA         1 mm connectorsNA                                     
TE0808-04-09EG-2IB  9eg_2i_4gb   REV04       4GB      64MB       NA         NA               NA                                     
TE0808-04-15EG-1EB  15eg_1e_4gb  REV04       4GB      64MB       NA         NA               NA                                     
TE0808-04-09EG-1EE  9eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-09EG-1EL  9eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-09EG-2IE* 9eg_2i_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-15EG-1EE  15eg_1e_4gb  REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-06EG-1EE  6eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-06EG-1E3  6eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-6GI21-L   6eg_2i_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-6BI21-A   6eg_1i_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-9GI21-A   9eg_2i_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-9BE21-A   9eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-6BE21-L   6eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-6BE21-A   6eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-9BE21-L   9eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-BBE21-A   15eg_1e_4gb  REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-6BI21-X   6eg_1i_4gb   REV04       4GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-6BE21-L   6eg_1e_4gb   REV05       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-05-6BE21-A   6eg_1e_4gb   REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-6BI21-D   6eg_1i_4gb   REV05       4GB      128MB      NA         1 mm connectorsSoC without encryption               
TE0808-05-6BI21-X   6eg_1i_4gb   REV05       4GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-6BI41-X   6eg_1i_8gb   REV05       8GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-9BE21-A   9eg_1e_4gb   REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-9BE21-L   9eg_1e_4gb   REV05       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-05-9BI41-X   9eg_1i_8gb   REV05       8GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-9GI21-A   9eg_2i_4gb   REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-9GI21-C   9eg_2i_4gb   REV05       4GB      128MB      NA         NA               SoC without encryption               
TE0808-05-BBE21-A   15eg_1e_4gb  REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-BBE21-L   15eg_1e_4gb  REV05       4GB      128MB      NA         1 mm connectorsNA                                     

TE0808-05-S002

15eg_1e_4gb

REV054GB128MBNANACAO
TE0808-05-S003 15eg_1e_4gbREV054GB128MBNANACAO
TE0808-05-S005 9eg_2i_4gb REV054GB128MBNANACAO
TE0808-05-S004 9eg_2i_4gb REV054GB128MBNANACAO
TE0808-05-6BE21-AK6eg_1e_4gb REV054GB128MBNANANA
TE0808-05-9BE21-LK9eg_1e_4gb REV054GB128MBNA1 mm connectorsNA
TE0808-05-9GI21-AK9eg_2i_4gb REV054GB128MBNANANA
TE0808-05-BBE21-AK15eg_1e_4gbREV054GB128MBNANANA
TE0808-05-S0069eg_2i_4gb REV054GB128MBNANACAO

*used as reference

Hardware Modules

Note: Design contains also Board Part Files for TE0803+TEBF0808 configuration, this board part files are not used for this reference design.

Design supports following carriers:

Carrier ModelNotes
Custom PCB use simple Board Part files, if MIO connected is different to TEBF0808
TEBF0808*Used as reference carrier.
TEBT0808-01Change UART0 to UART1 (MIO68...69) and regenerate design

*used as reference

Hardware Carrier

Additional HW Requirements:

Additional HardwareNotes
------

*used as reference

Additional Hardware

Content

For general structure and usage of the reference design, see Project Delivery - Xilinx devices

Design Sources

TypeLocationNotes
Vivado<project folder>\block_design
<project folder>\constraints
<project folder>\ip_lib
<project folder>\board_files
Vivado Project will be generated by TE Scripts
Vitis<project folder>\sw_libAdditional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation
Design sources

Additional Sources

TypeLocationNotes
---------
Additional design sources

Prebuilt

File

File-Extension

Description

BIF-File*.bifFile with description to generate Bin-File
BIN-File*.binFlash Configuration File with Boot-Image (Zynq-FPGAs)
BIT-File*.bitFPGA (PL Part) Configuration File
Diverse Reports---Report files in different formats
Hardware-Platform-Description-File*.xsaExported Vivado hardware description file for Vitis and PetaLinux
LabTools Project-File*.lprVivado Labtools Project File
Software-Application-File*.elfSoftware Application for Zynq or MicroBlaze Processor Systems
Prebuilt files (only on ZIP with prebult content)

Download

Reference Design is only usable with the specified Vivado/Vitis/PetaLinux version. Do never use different Versions of Xilinx Software for the same Project.

Reference Design is available on:

Design Flow


Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.

Trenz Electronic provides a tcl based built environment based on Xilinx Design Flow.

See also:

The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.

TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/Vitis GUI. For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality

Caution! Win OS has a 260 character limit for path lengths which can affect the Vivado tools. To avoid this issue, use Virtual Drive or the shortest possible names and directory locations for the reference design (for example "x:\<project folder>")

  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:

    _create_win_setup.cmd/_create_linux_setup.sh
    ------------------------Set design paths----------------------------
    -- Run Design with: _create_win_setup
    -- Use Design Path: <absolute project path>
    --------------------------------------------------------------------
    -------------------------TE Reference Design---------------------------
    --------------------------------------------------------------------
    -- (0)  Module selection guide, project creation...prebuilt export...
    -- (1)  Create minimum setup of CMD-Files and exit Batch
    -- (2)  Create maximum setup of CMD-Files and exit Batch
    -- (3)  (internal only) Dev
    -- (4)  (internal only) Prod
    -- (c)  Go to CMD-File Generation (Manual setup)
    -- (d)  Go to Documentation (Web Documentation)
    -- (g)  Install Board Files from Xilinx Board Store (beta)
    -- (a)  Start design with unsupported Vivado Version (beta)
    -- (x)  Exit Batch (nothing is done!)
    ----
    Select (ex.:'0' for module selection guide):
  2. Press 0 and enter to start "Module Selection Guide"
  3. Create project and follow instructions of the product selection guide, settings file will be configured automatically during this process.
    • optional for manual changes: Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"

      Note: Select correct one, see also Vivado Board Part Flow

      Important: Use Board Part Files, which did not end with *_tebf0808

  4. Create hardware description file (.xsa file) and export to prebuilt folder

    run on Vivado TCL (Script generates design and export files into "<project folder>\prebuilt\hardware\<short name>")
    TE::hw_build_design -export_prebuilt

    Using Vivado GUI is the same, except file export to prebuilt folder.

  5. Generate Programming Files with Vitis

    run on Vivado TCL (Script generates applications and bootable files, which are defined in "test_board\sw_lib\apps_list.csv")
    TE::sw_run_vitis -all
    TE::sw_run_vitis (optional; Start Vitis from Vivado GUI or start with TE Scripts on Vivado TCL)

    TCL scripts generate also platform project, this must be done manually in case GUI is used. See Vitis


Launch


Programming

Check Module and Carrier TRMs for proper HW configuration before you try any design.

Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.

Xilinx documentation for programming and debugging: Vivado/Vitis/SDSoC-Xilinx Software Programming and Debugging

Get prebuilt boot binaries

  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell
  2. Press 0 and enter to start "Module Selection Guide"
    1. Select assembly version
    2. Validate selection
    3. Select create and open delivery binary folder

      Note: Folder "<project folder>\_binaries_<Article Name>" with subfolder "boot_<app name>" for different applications will be generated

QSPI-Boot mode

  1. Connect JTAG and power on carrier with module
  2. Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"

    run on Vivado TCL (Script programs BOOT.bin on QSPI flash)
    TE::pr_program_flash -swapp hello_te0808

SD-Boot mode

This does not work, because SD controller is not selected on PS.

JTAG

Load configuration and Application with Vitis Debugger into device

Usage

QSPI Boot:

  1. Prepare HW like described on section Programming
  2. Connect UART USB (most cases same as JTAG)
  3. Select QSPI as Boot Mode

    Note: See TRM of the Carrier, which is used.

  4. Power On PCB

    1. ZynqMP Boot ROM FSBL from QSPI into OCM,

    2. FSBL init the PS, programs the PL using the bitstream and loads PMU, ATF and U-boot from QSPI into DDR

System Design - Vivado


Block Design

Block Design


PS Interfaces

Activated interfaces:

TypeNote
DDR
QSPIMIO
UART0MIO, please select other one, if you have connected UART to second controller or other MIO
SWDT0..1
TTC0..3
PS Interfaces

Constrains

Basic module constrains

_i_bitgen.xdc
set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design]
set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]

Design specific constrain

Not needed.

Software Design - Vitis


For Vitis project creation, follow instructions from:

Vitis

Application

Template location: "<project folder>\sw_lib\sw_apps\"

zynqmp_fsbl

TE modified 2021.2 FSBL

General:

  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
  • General Changes: 
    • Display FSBL Banner and Device Name

zynqmp_fsbl_flash

TE modified 2021.2 FSBL

General:

  • Modified Files: xfsbl_initialisation.c, xfsbl_hw.h, xfsbl_handoff.c, xfsbl_main.c
  • General Changes:
    • Display FSBL Banner
    • Set FSBL Boot Mode to JTAG
    • Disable Memory initialisation

hello_te0808

Hello TE0808 is a Xilinx Hello World example as endless loop instead of one console output.

Additional Software


No additional software is needed.

Appx. A: Change History and Legal Notices


Document Change History

To get content of older revision go to "Change History" of this page and select older document revision number.


DateDocument Revision

Authors

Description

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  • Design Bugfix
2022-03-16v.36Manuela Strücker
  • Release 2021.2
2021-05-25v.35Manuela Strücker
  • Document Style update

2021-05-12

v.34

John Hartfiel

  • update board files
2021-02-05v.33John Hartfiel
  • Release 2020.2
  • Document Style update
2021-02-05v.31John Hartfiel
  • new assembly variants
2020-03-25v.28John Hartfiel
  • script update
2020-01-27v.27John Hartfiel
  • documentation update
2020-01-22v.26John Hartfiel
  • new assembly variants
  • Release 2019.2
2019-08-09v.24John Hartfiel
  • new assembly variants
  • small document style update
2019-05-07v.22John Hartfiel
  • Release 2018.3
2018-07-11v.21John Hartfiel
  • Release 2018.2

2018-03-29

v.20John Hartfiel
  • new assembly variant
2018-02-08v.19John Hartfiel
  • Release 2017.4
2017-12-20v.14John Hartfiel
  • Design Update
  • typo correction on documentation
2017-11-22v.10John Hartfiel
  • Update assembly versions with new Flash size
  • Update HW Table Name
  • Update Design
2017-11-14v.6John Hartfiel
  • Release 2017.2
--all

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--
Document change history.

Legal Notices

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Technology Licenses

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RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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