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Table of Contents
Overview
The Trenz Electronic TE0821-01-3BI21FA is a powerful 4 x 5 cm MPSoC module with a Xilinx Zynq UltraScale + ZU3EG. In addition, the module is equipped with a 2 GB DDR4 SDRAM chip, 128 MB flash memory for configuration and data storage, as well as powerful switching power supplies for all required voltages. Robust high-speed connectors provide a large number of inputs and outputs.
This module is pin compatible with Trenz Electronic TE0820 MPSoC modules (JM2 pin 100 is not connected).
The highly integrated modules are smaller than a credit card and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are completely mechanically and largely electrically compatible with each other.
All components cover at least the industrial temperature range from -40 ° C to + 85 ° C. The temperature range in which the module can be used depends on the customer design and the selected cooling. Please contact us for special solutions.
Refer to http://trenz.org/te0821-info for the current online version of this manual and other available documentation.
Key Features
- SoC/FPGA
- Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784I
- ZU3EG, 784 Pin Packages
- Application Processor: Quad-Core ARM Cortex-A53 MPCore
- Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
- Graphics Processor: Mali-400 MP2
- Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784I
- RAM/Storage
- 2 GByte DDR4 SDRAM, 32-Bit databus-width
- 128 MByte QSPI boot Flash in dual parallel mode
- 8 GByte e.MMC Memory (up to 64 GByte)
- MAC address serial EEPROM with EUI-48 node identity
- On Board
- Graphic Processing Unit (GPU) :Mali-400 MP2
- Interface
- PCI Express interface version 2.1 compliant
- SATA 3.1 specification compliant interface
DisplayPort source-only interface with video resolution up to 4k x 2k
- USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
- 1 GB/s serial GMII interface
- Hi-speed USB2 ULPI transceiver with full OTG support
- 34 x High Performance und 96 x High Density PL I/Os
- 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
- 4 x serial PS GTR transceivers
- Rugged for shock and high vibration
- Power
- All power supplies on board
- Dimension
- 40 x 50 mm
Block Diagram
Main Components
- Xilinx Zynq UltraScale+ XCZU3EG, U1
- Red LED (ERR_OUT), D3
- Green LED (ERR_STATUS), D4
- Red LED (DONE), D1
- 10/100/1000 Mbps energy efficient ethernet transceiver, U8
- 8Gb DDR4, U2-U3
- 512 Mbit QSPI flash memory, U7-U17
- B2B connector Samtec Razor Beam, JM1
- Programmable clock generator, U10
- USB2.0 Transceiver, U18
- B2B connector Samtec Razor Beam, JM3
- B2B connector Samtec Razor Beam, JM2
- 8 GByte eMMC memory, U6
- Lattice Semiconductor MachXO2 System Controller CPLD, U21
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
QSPI Flash Memory | Not programmed | |
eMMC Memory | Not programmed | |
Programmable Clock Generator | Not programmed | |
CPLD (LCMXO2-256HC) | SC0820-02 QSPI Firmware |
Configuration Signals
Two different firmware versions are available, one with the QSPI boot option and other with the SD Card boot option.
MODE Pin | Boot Mode |
---|---|
Low | QSPI |
High | SD Card |
Signal | B2B | I/O | Note |
---|---|---|---|
EN | JM1-28 | Input | CPLD Enable Pin |
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
FPGA Bank | Type | B2B Connector | I/O Signal Count | Voltage Level | Notes |
---|---|---|---|---|---|
24 | HD | JM2 | 24x I/O, 12x LVDS Pairs | Variable | Max voltage 3.3V |
25 | HD | JM1 | 24x I/O, 12x LVDS Pairs | Variable | Max voltage 3.3V |
26 | HD | JM1 | 24x I/O, 12x LVDS Pairs | Variable | Max voltage 3.3V |
44 | HD | JM2 | 24x I/O, 12x LVDS Pairs | Variable | Max voltage 3.3V |
65 | HP | JM2 | 18x I/O, 9x LVDS Pairs | Variable | Max voltage 1.8V |
65 | HP | JM3 | 16x I/O, 8x LVDS Pairs | Variable | Max voltage 1.8V |
66 | HP | JM1 | 48 | Variable | Max voltage 1.8V |
505 | GTR | JM3 | 16x I/O, 8x LVDS Pairs | - | 4x lanes |
505 | GTR CLK | JM3 | 1x Diff Clock | - | |
501 | MIO | JM1 | 15 I/O | 3.3V |
JTAG Interface
JTAG access to the TExxxx SoM through B2B connector JMX.
JTAG Signal | B2B Connector |
---|---|
TMS | JM2-93 |
TDI | JM2-95 |
TDO | JM2-97 |
TCK | JM2-99 |
Pin 89 JTAGEN of B2B connector JM1 is used to control which device is accessible via JTAG. If set to low or grounded, JTAG interface will be routed to the Xilinx Zynq MPSoC. If pulled high, JTAG interface will be routed to the System Controller CPLD.
MIO Pins
MIO Pin | Connected to | B2B | Notes |
---|---|---|---|
Test Points
Test Point | Signal | Connected to | Notes |
---|---|---|---|
On-board Peripherals
Chip/Interface | Designator | Notes |
---|---|---|
Quad SPI Flash Memory
MIO Pin | Schematic | U?? Pin | Notes |
---|---|---|---|
EEPROM
MIO Pin | Schematic | U25 Pin | Notes |
---|---|---|---|
MIO39 | I2C_SDA | SDA | |
MIO38 | I2C_SCL | SCL |
MIO Pin | I2C Address | Designator | Notes |
---|---|---|---|
MIO38...39 | 0x50 | U25 |
LEDs
Designator | Color | Connected to | Active Level | Note |
---|---|---|---|---|
D1 | Red | DONE | High | |
D2 | Green | ERR_STATUS | High | |
D3 | Red | ERR_OUT | High |
DDR3 SDRAM
The TE0821 SoM has 8 Gb volatile DDR4 SDRAM IC for storing user application code and data.
- Part number: K4A8G165WB-BIRC
- Supply voltage: 1.2V
- Speed: 2400 mbps
- Temperature: -40 ~ 95 °C
Ethernet
U?? Pin | Signal Name | Connected to | Signal Description | Note |
---|---|---|---|---|
Clock Sources
Designator | Description | Frequency | Note |
---|---|---|---|
U11 | MEMS Oscillator | 25 MHz | |
U14 | MEMS Oscillator | 25 MHz |
Programmable Clock Generator
There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??. The I2C Address is 0x??.
U?? Pin | Signal | Connected to | Direction | Note |
---|---|---|---|---|
IN0 | ||||
IN1 | ||||
IN2 | ||||
IN3 | ||||
XAXB | ||||
SCLK | ||||
SDA | ||||
OUT0 | ||||
OUT1 | ||||
OUT2 | ||||
OUT3 | ||||
OUT4 | ||||
OUT5 | ||||
OUT6 | ||||
OUT7 | ||||
OUT8/OUT9 |
Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
Power Distribution Dependencies
Power-On Sequence
Voltage Monitor Circuit
Create DrawIO object here: Attention if you copy from other page, objects are only linked.
Power Rails
Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
---|---|---|---|---|---|
Bank Voltages
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
Board to Board Connectors
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
- 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
- 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
Order number | Connector on baseboard | compatible to | Mating height |
---|---|---|---|
23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
Connector Speed Ratings
The LSHM connector speed rating depends on the stacking height; please see the following table:
Stacking height | Speed rating |
---|---|
12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
12 mm, Differential | 6.5 GHz / 13 Gbps |
5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
5 mm, Differential | 7.0 GHz / 14 Gbps |
Current Rating
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
Connector Mechanical Ratings
- Shock: 100G, 6 ms Sine
- Vibration: 7.5G random, 2 hours per axis, 3 axes total
Manufacturer Documentation
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
V | ||||
V | ||||
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
V | See ???? datasheets. | |||
V | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. |
Physical Dimensions
Module size: 40 mm × 50 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.74 mm.
Currently Offered Variants
Trenz shop TE0821 overview page | |
---|---|
English page | German page |
Revision History
Hardware Revision History
Date | Revision | Changes | Documentation Link |
---|---|---|---|
2019-04-26 | REV01 |
| REV01 |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
|
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
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REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.