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The Trenz Electronic TE0821 is a powerful 4 x 5 cm SoM integrating an AMD Zynq UltraScale+ MP-SoC. In addition, the module is equipped with two DDR4 SDRAM chip for up to 4 GByte, up to 64 GB eMMC chip, two 64 MByte QSPI Flash memory for configuration and data storage, as well as powerful switching power supplies for all required voltages. The module is equipped with a system controller (Lattice Mach XO2). Three robust high-speed B2B connectors provide a large number of IOs.
Refer to http://trenz.org/te0821-info for current online available documentation.
Storage device name | Content | Notes |
|---|---|---|
Dual QSPI Flash Memory | Not programmed | |
eMMC Memory | Not programmed | |
DDR4 SDRAM | Not programmed | |
Programmable Clock Generator | Not programmed | |
System Controller | Firmware | Refer to TE0821 CPLD Firmware / TE0821 CPLD / TE0821-01-REV01 CPLD for more information. |
Connector Type | Designator | Interface | IO CNT | Notes |
|---|---|---|---|---|
B2B | JM1 | IO HD | 24x SE / 12x DIFF | Bank 25 |
B2B | JM1 | IO HD | 24x SE / 12x DIFF | Bank 26 |
B2B | JM2 | IO HD | 24x SE / 12x DIFF | Bank 24 2) |
B2B | JM2 | IO HD | 24x SE / 12x DIFF | Bank 44 |
B2B | JM2 | IO HP | 18x SE / 9x DIFF | Bank 65 |
| B2B | JM3 | IO HP | 16x SE / 8x DIFF | Bank 65 |
B2B | JM1 | MIO | 8x SE | Bank 501 |
B2B | JM1 | MIO / SDIO | 6x SE | Bank 501 |
B2B | JM3 | MGT | 4x GTR | Bank 505 |
B2B | JM3 | MGT CLK | 1x DIFF | Bank 505 |
B2B | JM1 | ETH MDI | 4x DIFF | |
B2B | JM3 | ETH SGMII | 2x DIFF | |
B2B | JM3 | USB 2.0 | 3x Se + 1x DIFF | Bus voltage, control and data |
B2B | JM3 | CLK in | 1x DIFF | Clock Generator |
1) Refer to 4 x 5 SoM Integration Guide for more information regarding 4 x 5 SoM compatibility.
2) TE0820 and TE0823 have two more IOs at connector JM2 (JM2 - pin 89 and JM2 - pin 100).
Test Point | Top | Bottom | Signal | Notes |
|---|---|---|---|---|
TP1 | x | I2C_SCL | ||
TP2 | x | I2C_SDA | ||
TP3 | x | SRST_B | ||
TP4 | x | PS_CLK | ||
TP5 | x | PROG_B | ||
TP6 | x | INIT_B | ||
TP7 | x | DONE | ||
TP8 | x | PS_LP0V85 | ||
TP9 | x | DDR_2V5 | ||
TP10 | x | PS_MGTRAVCC | ||
TP11 | x | DDR_1V2 | ||
TP12 | x | PS_MGTRAVTT | ||
TP13 | x | PS_FP0V85 | ||
TP14 | x | POR_B | ||
TP15 | x | PS_PLL | ||
TP16 | x | PL_VCCINT | ||
TP17 | x | DDR4-TEN | ||
TP18 | x | AVDD18 | ||
TP19 | x | PL_VCCINT_IO | ||
TP20 | x | PL_VCU | ||
TP21 | x | DVDD1V | ||
TP22 | x | VTT | ||
TP23 | x | VREFA | ||
TP24 | x | PS_PLL | ||
TP25 | x | PG_ALL |
| Chip/Interface | Designator | Connected To | Notes |
|---|---|---|---|
AMD Zynq UltraScale+ MP-SoC | U1 |
| |
DDR4 SDRAM | U2 / U3 |
| |
QSPI Flash | U7 / U17 |
| |
eMMC | U6 |
| |
System Controller | U21 |
| Refer to TE0821 CPLD Firmware / TE0821 CPLD / TE0821-01-REV01 CPLD for more information. |
Programmable Clock Generator | U10 |
| |
Ethernet PHY | U8 |
| |
EEPROM with MAC | U25 |
| |
USB 2.0 PHY | U18 |
| |
Oscillator | U32 |
| 33⅓ MHz |
| Oscillator | U11 |
| 25 MHz |
| Oscillator | U14 |
| 52 MHz |
Signal Name | Connector.Pin | Direction 1) | Description |
|---|---|---|---|
EN | JM1.28 | IN | Power Enable Pin. Firmware dependent, when R113 is populated 2). In default assembly variants R113 is unpopulated. |
PGOOD | JM1.30 | INOUT | PGOOD Pin. Firmware dependent 2) |
MODE | JM1.32 | IN | ZynqMP Boot Mode Pin 0. Firmware dependent 2) |
NOSEQ | JM1.7 | INOUT | No Sequencing. Firmware dependent 2) |
MR | JM2.18 | IN | Manuel reset |
JTAGEN | JM1.89 | IN | Select JTAG access between FPGA or System Controller. Firmware dependent 2) |
JTAG (C_TMS / C_TDI / C_TDO / C_TCK) | JM2.93 / JM2.95 / JM2.97 / JM2.99 | Signal dependent | JTAG interface |
1) Direction:
IN: Input from the point of view of this board.
OUT: Output from the point of view of this board.
2) For further information see TE0821 CPLD Firmware / TE0821 CPLD / TE0821-01-REV01 CPLD.
Power Rail Name / Schematic Name | Connector.Pin | Direction 1) | Notes |
|---|---|---|---|
VIN | JM2.2 / JM2.4 / JM2.6 / JM2.8 / JM1.1 / JM1.3 / JM1.5 | IN | |
3.3VIN | JM2.91 / JM1.13 / JM1.15 | IN | |
PSBATT | JM1.79 | IN | |
VCCO_65 | JM2.5 | IN | |
VCCO_HD25_26 | JM1.9 / JM1.11 | IN/OUT 2) | On request this bank voltage can be supplied from 3.3 V |
VCCO_HD24_44 | JM2.7 / JM2.9 | IN/OUT 3) | On request this bank voltage can be supplied from 3.3 V |
3.3V | JM2.10 / JM2.12 | OUT | |
1.8V | JM1.39 | OUT |
1) Direction:
2) If resistor R89 is assembled do not supply this power rail externally because these connector pins are outputs.
3) If resistor R6 is assembled do not supply this power rail externally because these connector pins are outputs.
| Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
|---|---|---|---|---|---|
| 0 | - | - | - | Setup configuration SoM signals. | |
| 1 | VIN | 3.3 V to 5.0 V ±5 % | - | Apply main SoM supply. | Signal "EN" needs to be released. |
3.3VIN | 3.3 V ±5 % | - | Apply management SoM supply. | ||
| 2 | 3.3V | - | - | SoM generated output of 3.3V or 1.8V states external power supply can be delivered. | Improved power up sequencing can be realized via system controller firmware. Refer to TE0821 CPLD Firmware / TE0821 CPLD / TE0821-01-REV01 CPLD for more firmware information. |
1.8V | - | ||||
| 3 | VCCO_HD_24_44 | 1.2 V to 3.3 V ±3 % | - | Apply SoC bank IO supplies. | |
VCCO_HD25_26 | 1.2 V to 3.3 V ±3 % | - | |||
VCCO_65 | 1.0 V to 1.8 V ±3 % | - |
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
| Order number | Connector on baseboard | compatible to | Mating height |
|---|---|---|---|
| 23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
| 26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
| 12 mm, Differential | 6.5 GHz / 13 Gbps |
| 5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
| 5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
| File | Modified | |
|---|---|---|
| PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File lshm_dv.pdf LSHM catalog page | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File tc0929--2611_qua(1).pdf Shock and vibration report | Apr 07, 2016 by Thorsten Trenz | |
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| Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
|---|---|---|---|---|
VIN | Main SoM supply | -0.3 | 7 | V |
3.3VIN | Managment supply | -0.1 | 3.630 | V |
PSBATT | Backup battery | -0.5 | 2.0 | V |
VCCO_65 | IO supply | -0.5 | 2.0 | V |
VCCO_HD_25_26 | IO supply | -0.5 | 3.4 | V |
VCCO_HD_24_44 | IO supply | -0.5 | 3.4 | V |
*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.
The categories are:
Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.
These categories do not take into account the entire custom system consisting of:
Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
Cooling solution, active and or passive cooling.
Climate or environmental conditions besides ambient temperature range.
Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.
Classification of the module can be looked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.
The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.
The following table aims to be generic for all variants. The voltage ranges are consistend across assembly variants, but exceptions are possible (custom request).
Module size: 40 mm × 50 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
| Trenz shop TE0821 overview page* | |
|---|---|
| English page | German page |
*) Module article name encoding table: Zynq Ultrascale+ based modules (MPSoC, RFSoC)
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Date | Revision | Changes | Documentation Link |
|---|---|---|---|
2024-11 | REV02 |
| |
2019-04 2019-07 2021-08 2024-02 | REV01 | Initial Release 1.R38 value was changed to 20K (was: 40K2) to set VCU 0.9V 2. Change SPI Flash from N25Q512A11G1240E to MT25QU512ABB8E12-0SIT. 4. Change eMMC (U6) from IS21ES08G-JCLI / IS21ES64G-JCLI to SDINBDG4-8G-XI2 / SDINBDG4-64G-XI2. 8. Pull-up resistor (R82) removal for signal "MR". |
| Date | Revision | Contributor | Description |
|---|---|---|---|
| |||
2025-10-24 | v.80 | Kilian Jahn |
|
2025-08-11 | v.79 | Maksim Tserabei |
|
| |||
v.73 | Maksim Tserabei |
| |
v.63 | Martin Rohrmüller |
| |
| 2021-07-05 | v.61 | John Hartfiel |
|
| 2021-06-07 | v.59 | Vadim Yunitski |
|
| 2020-07-15 | v.50 | Pedram Babakhani |
|
-- | all |
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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