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Overview

The Trenz Electronic TE0955 is an AMD Versal AI Edge SoC based System on Module (SoM).

The SoC combines a dual core Arm Cortex-A72 Application Processor, a dual core Arm Cortex-R5F Real Time Processor, a FPGA and an AI Engine Machine Learning (AIE-ML).

The module integrates the SoC's two Quad GTYP transceivers, DDR4LP SDRAM, SPI Flash memory for configuration and operation, a Gigabit Ethernet PHY, a USB 2.0 PHY and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged B2B connectors.

Refer to http://trenz.org/te0955-info for current online available documentation.

Key Features

  • SoC

    • AMD Versal
      • AI Edge:          VE2202 / VE2302 1)
      • Prime:             VM1102 1)
    • Speedgrade:             -1 / -2 / -3 1)
    • Temperature Range: Extended / Industrial 1)
    • Package:                   SFVA784 
  • RAM/Storage

    • 8 GByte LPDDR4 2)
    • 256 MByte OSPI Flash (with XiP support) 2)
    • 32 GByte e.MMC 2)
    • EEPROM with unique EUI-48 Ethernet MAC and 192 Byte usable storage
  • On Board

    • 10/100/1000 BASE-T/X Ethernet Transceiver (TSN, PTP)
    • USB 2.0 Transceiver
    • OPTIGA™ Trust M Security Element
    • CryptoAuthentication™ Device
    • Trusted platform module (TPM)
    • Clocks for SoC PL, PS, DDR4 and PHYs
  • Interface

    • Trenz 4 x 5.64 SoM 2x B2B Connector (Samtec ADM6) socket:
      • MIO:    24x SE
      • XPIO:   58x SE / 27x DIFF / 4x MIPI
      • HDIO:  22x SE / 11x DIFF / 2x MIPI
      • GTYP:  8x MGT and 4x CLK
    • Andromeda standard form factor compatible
  • Power

    • Single 12V power supply
  • Dimension

    • 40 mm x 56.4 mm

  • Notes
    1) Available as assembly variant or upon request.
    2) Other sizes/devices, which are pin/package-compatible, upon request.

Block Diagram




TE0955 block diagram

Main Components


TE0955 main components (Underlying Pictures are REV01)
  1. Versal Adaptive SoC, U1
  2. LPDDR4, U35, U36
  3. OSPI NOR Flash, U34
  4. e.MMC, U2
  5. Ethernet PHY, U3
  6. OPTIGA™ Trust M Security Element, U14
  7. CryptoAuthentication™ Device, U15
  8. Trusted Platform Module (TPM) U37
  9. Serial EEPROM with 48bit MAC, U17
  10. USB 2.0 Transceiver, U5
  11. Crystal, Y1
  12. Oscillator for Ethernet 25 MHz, U4
  13. Oscillator for USB 24 MHz, U6
  14. Oscillator for SoC 33 MHz Bank 503, U24
  15. Oscillator for LPDDR4 200 MHz, U27, U28
  16. LED red, signals PG_ALL, D1
  17. LED red, signals initialisation DONE, D2
  18. LED red, signals V_ERROR, D3
  19. B2B, JM5, JM6

Initial Delivery State

Storage device name

Content

Notes

Octal SPI Flash, U34

Not programmed

e.MMC, U2

Not programmed

EEPROM, U17

Manufacturer programmed MAC


LPDDR4 SDRAM, U35, U36

Not programmed


Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO count

Notes

B2BJM5IO HP54x SE / 27x DIFFBank 703
B2BJM5MGT8x GTYPBanks 103 & 104
B2BJM5MGT CLK4x GTYP CLKBanks 103 & 104
B2BJM6IO HD22x SE / 11x DIFFBank 302
B2BJM6ETH MDI8x DIFFBank 502
B2BJM6ETH PHY LED2x SEBank 502
B2BJM6SDIO11x SEBank 501
B2BJM6GPIO4x SEBank 501 & 502
B2BJM6USB 2.01x DIFFBank 500
Board Connectors


Test Points

Test

Point

REV02

REV01

Signal

Top

Bottom

Notes

Signal

TP1

x



3V3_AO

TP2

x



DDR_1V1

TP3


x


3V3_AO

TP4


x


DDR_1V1

TP5

x



3V3

TP6


x


3V3

TP7

x



1V8

TP8


x


1V8

TP9

x



OM_SCL

TP10

x



TDI

TP11

x



OM_SDA

TP12

x



TDO

TP13

x



GND

TP14

x



TCK

TP15

x



TMS

TP16

x



V_IO_CFG

TP17


x


GND

TP18

x



V_VCC_CORE

TP19


x


V_VCC_CORE

TP20

x



V_FUSE

TP21

x



V_VCC_SOC

TP22


x


V_VCC_SOC

TP23

x



V_VCCAUX

TP24


x


V_VCCAUX

TP25

x



GTYP_AVCC

TP26


x


GTYP_AVCC

TP27

x



GTYP_AVCC_AUX

TP28


x


GTYP_AVCC_AUX

TP29

x



PG_ALL

TP30

x



GTYP_AVTT

TP31


x


GTYP_AVTT

TP32

x



TPM_PP

Not used

Test Points Information

On-board Peripherals

Chip/Interface

Designator

Connected To

Notes

SoC

U1
  • Ethernet PHY
  • USB PHY
  • JM5, JM6
  • I2C

LPDDR4

U35, U36
  • SoC

OSPI

U34
  • SoC

eMMC

U2
  • SoC

Ethernet PHY

U3
  • SoC
  • JM6
  • Oscillator
Supports TSN, PTP

OPTIGA™ Trust M Security Element

U14
  • SoC
  • JM6
  • I2C

CryptoAuthentication™ Device

U15
  • SoC
  • JM6
  • I2C

Trusted Platform Module

U37
  • SoC
  • JM6
  • I2C

EEPROM with MAC

U17
  • SoC
  • JM6
  • I2C

USB PHY

U5
  • Oscillator

Chrystal

Y1
  • SoC
Default assembly 32.768 kHz.

Oscillator

U24
  • SoC
Default assembly 33⅓ MHz.

Oscillator

U27
  • SoC LPDDR4 Bank

REF CLK for Memory controller.

Default assembly 200 MHz.

Oscillator

U28
  • SoC Bank 702

User PL clock

Default assembly 200 MHz.

OscillatorU4
  • Ethernet PHY
Default assembly 25 MHz.
OscillatorU6
  • USB PHY
Default assembly 24 MHz.
On board peripherals

Configuration and System Control Signals

Signal Name

Connector.Pin

Direction

Description

JTAG( TDI / TCK / TDO / TMS )

JM6.D51 / JM6.D52 / JM6.D54 / JM6.D55

Signal dependent

SoC JTAG.

UART0_RX / UART0_TX

JM6.B49 / JM6.B50

Signal dependent

Software implementation dependent.

Alternative GPIO/I2C1_SCL/CAN_FD_1_TX (no pull-up at SoM).
Alternative GPIO/I2C1_SDA/CAN_FD_1_RX (no pull-up at SoM).

UART1_RX / UART1_TX

JM6.A49 / JM6.50

Signal dependent

Software implementation dependent.

Alternative GPIO/I2C1_SDA/CAN_FD_1_RX (no pull-up at SoM).
Alternative GPIO/I2C1_SCL/CAN_FD_1_TX (no pull-up at SoM).

I2C( M_INT# / M_SCL / M_SDA )

JM6.C49 / JM6.C50 / JM6.C51

Signal dependent

Software implementation dependent.

I2C( U_SCL / U_SDA / U_INT# )

JM6.D33 / JM6.D34 / JM6.D35

Signal dependent

Software implementation dependent.

USB0_ID / USB0_CPEN / V_USB0

JM6.47 / JM6.C48 / JM6.D46

Signal dependent

Software implementation dependent.

PERST0# / PERST1#

JM6.B51 / JM6.B52

INOUT

Intended for use as PCIe reset signal from PL or PS side of the SoC. Can be used as IO pin.

PWR_EN

JM6.D58

IN

Enable SoM Power Rails.

PWR_EN_IO

JM6.D59

OUT

Signals to carrier to enable the IO Voltage Rails.

ERROR_R 2)

JM6.A39

OUT

The ERROR_OUT pin is an output-only, open-drain signal with a weak internal pull-up and an external pull-up. When an error occurs in the device, the ERROR_OUT signal is put in a High-Z state and pulled High. The specific errors that cause this pin to assert can be determined and programmed by software.

RST_CPU#

JM6.C58

INOUT

Option; connectable to GPIO0

RST_SYS# 2)

JM6.C59

IN

Signals to carrier Power Good of all voltage converters. Acts as external SoM reset signal when pulled low.

RST_M2C#

JM6.B58

OUT

Signals to carrier a SoM reset event occurs. 

SoM reset signal for OSPI, e.MMC and Ethernet. Also connected to SoC RST# signal. Option; connectable to GPIO3_LS.

MODE0 / MODE1 / MODE2 / MODE3 2)

JM6.C54 / Jm6.C55 / JM6.C56 / JM6.C57

IN

The MODE[3:0] pins are used to select the boot mode for the device. The value of these pins is captured on the rising edge of POR_B. See Boot Modes and Interfaces for available boot mode details.

DONE 2)

JM6.C53

OUT

The DONE pin is an output-only, open-drain signal with a weak internal pull-up. An external pull-up is recommended. DONE is controlled by the DONE register. After POR, the DONE signal is Low. When the PLM successfully completes the boot sequence, the software sets the [DONE] bit High, which causes the output buffer to float and be pulled High externally.

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidirectional signal.
    • Signal dependent: A Signal can have different functions and directions as part of a Bus.

2) See Introduction to Versal Adaptive SoCs for further insights.

Controller signal.

Power and Power-On Sequence

Power Rails

Power Rail Name / Schematic Name

Connector.Pin

Direction1)

Notes

V_MOD1

JM5.A7 / JM5.A15 / JM5.A47 / JM5.A55 / JM5.B5 / JM5.B11 / JM5.B17 / JM5.B45 / JM5.B51 / JM5.B57 / JM6.C5 / JM6.C11 / JM6.C17 / JM6.D7 / JM6.D15

IN


V_IO_CFG

JM6.C52

IN


V_IO_W01

JM5.D3 / JM5.D17

IN


V_IO_X3

JM6.B59

IN


V_BAT

JM6.A59

IN


1V8

JM5.C7 / JM5.C15 / JM6.B7 / JM6.B15

OUT


3V3_AO

JM6.B59

OUT


1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

Module power rails.

Recommended Power up Sequencing


Sequence

Net name

Recommended Voltage Range

Pull-up/down

Description

Notes

0 ---Configuration signal setup.

See Configuration and System Control Signals.

1V_MOD15 V to 12 V-Apply power to the SoM.
2PWR_EN-Pull-up 3.3 VEnable power to peripheral SoM devices.
3PWR_EN_IO-Pull-up 3.3 VWhen high, apply IO Bank Voltages.
4

V_IO_CFG

V_IO_W01

V_IO_X3

1.71 V to 1.89 V

0.95 V to 1.57 V

1.71 V to 3.399 V

-Connect IO Bank Voltage power supply.
Baseboard Design Hints

Board to Board Connectors

The 4 x 5.64 modules use Samtec AcceleRate HD High-Density on bottom side.
  • ADM6-60-01.5-L-4-2 (legacy) or ADM6-60-01.5-L-4-0 (240 pins, 60 per row)
    •  Mates with ADF6-60-03.5-L-4-2 (legacy) or ADF6-60-03.5-L-4-0

The carriers use Samtec AcceleRate HD High-Density on top side.

  • ADF6-60-03.5-L-4-2 (legacy) or ADF6-60-03.5-L-4-0 (240 pins, 60 per row)
    • Mates with ADM6-60-01.5-L-4-0 (legacy) or ADM6-60-01.5-L-4-2
Features
  • Board-to-Board connector 240-pins / 60 contacts per row
  • Pitch:           0.025" (0.635 mm)
  • Data Rate:
    • ADM6-XX-XX.X-X-X-2: 56 Gbps
    • ADM6-XX-XX.X-X-X-0: 64 Gbps
  • Mates with: ADM6/APF6
  • Insulator Material: Black LCP
  • Contact Material:  Copper Alloy
  • Plating:                 Au or Sn over 50 µ" (1.27 µm) N
  • Operating Temperature Range: -55 ºC to +125 ºC
  • Lead-Free solderable: Yes
  • RoHS Compliant:        Yes
Connector Mating height

When using the same type on baseboard, the mating height is 5 mm. Other mating heights are possible by using connectors with a different height:

Order numberREF numberSamtec NumberTypeContribution to stacking heightComment
30095REF-30095ADM6-60-01.5-L-4-2Module connector1.5 mmStandard connector used on modules (legacy)
- -ADM6-60-01.5-L-4-0Module connector1.5 mmAlternative connector
31137REF-31137ADF6-60-03.5-L-4-2Baseboard connector3.5 mmStandard connector used on carrier (legacy)
--ADF6-60-03.5-L-4-0Baseboard connector3.5 mmAlternative connector
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The AcceleRate HD High-Density connector speed rating depends on the stacking height; please see the following table:

ConnectorStacking heightSpeed rating
ADM6-XX-XX.X-X-X-25 mm56 Gbps
ADM6-XX-XX.X-X-X-05 mm64 Gbps
Speed rating.
Current Rating

Current rating of Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered).

Connector Mechanical Ratings
  • Shock:      100G, 6 ms Sine
  • Vibration:  7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation



Technical Specifications


Absolute Maximum Ratings *)

Power Rail / Schematic Name

Description

Min

Max

Unit

V_MOD1

SoM power supply

-0.3

18

V

V_IO_CFG

SoC Configuration Bank power supply

0

3.6

V

V_IO_W01

SoC IO Bank 703 power supply

-0.3

1.65

V

V_IO_X3

SoC IO Bank 302 power supply

-0.3

3.63

V

V_BAT

Backup power supply

-0.5

3.63

V


Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
  • Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
  • Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
  • Cooling solution, active and or passive cooling.
  • Climate or environmental conditions besides ambient temperature range.
  • Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.

Classification of the module can be locked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

Parameter

Min

Max

Unit

Reference Document

V_MOD1

4.7512.6

V

See schematic.

V_IO_CFG

1.711.89

V

See schematic.

V_IO_W01

0.951.575

V

See schematic.

V_IO_X3

1.713.399

V

See schematic.

V_BAT

1.2151.485

V

See schematic.

V1V8

1.711.89

V

See schematic.

3V3_AO

3.2013.399

V

See schematic.
Recommended operating conditions.

Physical Dimensions

  • Module size: 40 × 56.4 mm. Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm

  • PCB thickness: 2.0 mm ±10 %

All dimensions are shown in millimeters.



Physical Dimension

Currently Offered Variants 

Trenz shop TE0955 overview page*

English page

German page

*)  Module article name encoding table: AMD Versal based modules

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

The hardware revision number is located on the PCB next to the module identifier, separated by a dash.



Board hardware revision number.


Date

Revision

Changes

Documentation Link

2025-12

REV02

1. Set R156 to assembled and connected to GTYP_AVCC_AUX rail instead of 1V8. Removed patch including R156_NEW.
2. Corrected and updated silkscreen description of Connectors JM5 and JM6 to show also Andromeda connector naming W and X. Removed corresponding schematic notes.
3. Moved serial sticker from bottom to top. Now placed on Ethernet PHY U3.
4. Removed unnecessary zero Ohm R159.
5. Replaced 0402 resistor R157 by 0201 size version.
6. Moved R52 and R74 away from PCB edge/tab.
7. Moved R14, R16, R19, R60, R64, R79, C19,C52 C186 C194, C196, C203 L11 away from ATS holder area.
8. Replaced buffers U7, U10, U16, U25 from 74LVC2G07FZ4-7 to SN74LVC2G07DSF2
9. Added TPM module U37 with corresponding circuits
10. Added option for additional pullups (not fitted: R196, R197) on OM_I2C bus
11. Moved Testpoints: TP7, TP9, TP13, TP16, TP20, TP21, TP27
12. Updated schematic overview page template
13. Added Note that U14, U15 may be removed in future.
14. Added OSPI assembly option (R198, R199) to use MIO12 as dedicated reset instead of ECS#.
15. Change ETH PHY from LAN8830 to LAN8840 to support TSN/PTP

REV02

2025-02

REV01

Initial release

REV01

Hardware Revision History

Document Change History

Date

Revision

Contributor

Description







Kilian Jahn

  • Corrected minor errors

2026-01-23

v.6

 Martin Rohrmüller

  • Updated to REV02

v.4

Martin Rohrmüller

  • Corrected Typo in block diagram

v.2

Kilian Jahn

  • Initial TRM in template revision 4.3.2

--

all

  • --

Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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