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Table of Contents

Overview

Trenz Electronic TEM0007 module is an industrial-grade FPGA micromodule integrating a Microsemi Polarfire SoC FPGA, Gigabit Ethernet PHY, USB PHY 2.0, one GByte LPDDR4 SDRAM, 64 MByte SPI Flash memory for configuration and operation, and power supply. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.

Refer to http://trenz.org/tem0007-info for the current online version of this manual and other available documentation.

Key Features

  • SoC/FPGA
    • Industrial-grade Microsemi Polarfire SoC MPFS250T-1FCVG484I
  • RAM/Storage
    • 1 GByte LPDDR4
    • 64 MByte SPI Flash Memory
  • On Board
    • System Controller CPLD
    • MAC address serial EEPROM
  • Interface
    • 10/100/1000 Mbps Gigabit Ethernet PHY
    • Highly Integrated Full-Featured Hi-Speed USB 2.0 ULPI Transceiver
    • Trenz 4 x 5 module socket connectors (3 x Samtec LSHM series connectors)
  • Power
    • On-board DC-DC converter
  • Dimension
    • 40 mm x 50 mm


Block Diagram

TEM0007 block diagram

Main Components

TExxxx main components
  1. Microsemi Polarfire SoC MPFS250T, U2
  2. 1 GByte LPDDR4 SDRAM, U6
  3. Integrated 10/100/1000 Mbps Energy Efficient Ethernet Transceiver, U7
  4. Highly Integrated Full Featured Hi-Speed USB 2.0 ULPI Transceiver, U11
  5. Lattice Semiconductor MachXO2 System Controller CPLD, U1
  6. B2B Connector Samtec Razor Beam, JM1...3
  7. EEPROM, U10
  8. Serial NOR Flash, U3

Initial Delivery State

Storage device name

Content

Notes

SPI NOR Flash, U3

Not programmed

-

EEPROM, U10Pre-programmed globally unique MAC

-

System Controller CPLD, U1Standard firmware-
Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
0JM2181.2 V / 1.35 V / 1.5 V / 1.8 VHSIO dependent on VCCIOD
0JM3161.2 V / 1.35 V / 1.5 V / 1.8 VHSIO dependent on VCCIOD
1JM1481.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 VGPIO dependent on VCCIOB
1JM2361.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 VGPIO dependent on VCCIOB
4JM163.3 VMSSIO
4JM163.3 VSDIO or MSSIO
4JM123.3 VUART or MSSIO
5JM34-SGMII (1 pair for TX / 1 pair for RX)
5JM316-SERDES (4 pairs for TX / 4 pairs for RX)
5JM34-SERDES CLK (2 pairs for RX)
General SoC I/O to B2B connectors information

JTAG Interface

JTAG access to the TEM0007 SoM through B2B connector JM2.

JTAG Signal

B2B Connector


TMSJM2-93
TDIJM2-95
TDOJM2-97
TCK

JM2-99


JTAGSELJM1-89

Pulled Low: Microsemi Polarfire SoC

Pulled High: Lattice MachXO CPLD

JTAG pins connection

UART Interface

The UART interface is connected from the Polarfire SoC to the B2B connector. If this interface is not necessary, these pins can be used for other functionality.

FPGA Bank 4Connected toB2BNotes
MSSIO11 - H2UART_RXJM1 - 92
MSSIO12 - H5UART_TXJM1 - 85
UART interface description

SDIO Interface

The SDIO interface is connected from the Polarfire SoC to the B2B connector. If this interface is not necessary, these pins can be used for other functionality.

FPGA Bank 4Connected toB2BNotes
MSSIO0 - J1SDIO_CLKJM1 - 27
MSSIO1 - K5SDIO_CMDJM1 - 25
MSSIO2 - H1SDIO_DAT0JM1 - 23
MSSIO3 - J4SDIO_DAT1JM1 - 21
MSSIO4 - K4SDIO_DAT2JM1 - 19
MSSIO5 - J7SDIO_DAT3JM1 - 17
SDIO interface description

MSSIO Interface

The MSSIO interface is connected from the Polarfire SoC to the B2B connector.

FPGA Bank 4Connected toB2BNotes
MSSIO6 - K3MIO0JM1 - 97
MSSIO7 - H4MIO1JM1 - 91
MSSIO8 - J6MIO2JM1 - 99
MSSIO9 - H6MIO3JM1 - 87
MSSIO10 - J3MIO4JM1 - 95
MSSIO13 - J2MIO5JM1 - 93
MSSIO interface description

SGMII Interface

The Polarfire Soc provides two SGMII interfaces whereby one interface is connected to the B2B connector.

FPGA Bank 5Connected toB2BNotes
U2 - N8SGMII1_OUT_NJM3 - 1
U2 - M7SGMII1_OUT_PJM3 - 3
U2 - K7SGMII1_IN_NJM2 - 2
U2 - K6SGMII1_IN_PJM2 - 4
SGMII interface description

MGT Lanes

There are four MGT (Multi Gigabit Transceiver) lanes and two two clocks connected between the B2B connector JM3 and the Polarfire SoC bank 5. Each MGT lane consists of one transmit and one receive (TX/RX) differential pairs, four signals total per one MGT lane. Following table lists lane number, signal schematic name, and board-to-board pin connection:

Lane

Schematic

B2BNote
0XCVR_RX0_PJM3-26
0XCVR_RX0_NJM3-28
0XCVR_TX0_NJM3-25
0XCVR_TX0_PJM3-27
1XCVR_RX1_PJM3-20
1XCVR_RX1_NJM3-22
1XCVR_TX1_PJM3-19
1XCVR_TX1_NJM3-21
2XCVR_RX2_PJM3-14
2XCVR_RX2_NJM3-16
2XCVR_TX2_PJM3-13
2XCVR_TX2_NJM3-15
3XCVR_RX3_PJM3-8
3XCVR_RX3_NJM3-10
3XCVR_TX3_PJM3-7
3XCVR_TX3_NJM3-9
CLKXCVR_CLK0_PJM3-33
CLKXCVR_CLK0_PJM3-31
CLKXCVR_CLK1_PJM3-32
CLKXCVR_CLK1_NJM3-34
MGT Lanes Connection

Gigabit Ethernet

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC. The Ethernet PHY SGMII interface is connected to the Polarfire SoC.

ETH PinConnected toB2BNotes
MDIP[0] - 28PHY_MDI0_PJM1 - 4
MDIN[0] - 27PHY_MDI0_NJM1 - 6
MDIP[1] - 24PHY_MDI1_PJM1 - 10
MDIN[1] - 23PHY_MDI1_NJM1 - 12
MDIP[2] - 22PHY_MDI2_PJM1 - 16
MDIN[2] - 21PHY_MDI2_NJM1 - 18
MDIP[3] - 18PHY_MDI3_PJM1 - 22
MDIN[3] - 17PHY_MDI3_NJM1 - 24
Gigabit Ethernet pin description

System Controller CPLD I/O Pins

The System Controller CPLD (U1) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 product family). It is the central system management unit with module specific firmware installed to monitor and control various signals of the FPGA, on-board peripherals, I/O interfaces and module as a whole.


CPLD PinConnected toB2BNotes
TDO - 1TDOJM2 - 97
TDI - 32TDIJM2 - 95
TCK - 30TCKJM2 - 99
TMS - 29TMSJM2 - 93
JTAGENB - 26JTAGSELJM1 - 89

- 11

SC_EN1JM1 - 28
- 12SC_PGOODJM1 - 30
- 14SC_nRSTJM2 - 18
- 17NOSEQJM1 - 7
System Controller CPLD special purpose pin description

USB Interface

USB PHY is provided by Microchip USB3320. The ULPI interface is connected to the Polarfire SoC. I/O voltage is fixed at 3.3 V. Reference clock input for the USB PHY is supplied by the on-board 52.00 MHz oscillator (U12).

PHY PinConnected toB2BNotes

DP - 18,

OTG-D_P

JM3 - 47USB data line
DM - 19OTG-D_NJM3 - 49USB data line
CPEN - 17VBUS_ENJM3 - 53External USB power switch
VBUS - 22VBUSJM3 - 55
ID - 23IDJM3 - 51
General Overview of the USB PHY Signals

On-board Peripherals

On board peripherals

System Controller CPLD

The System Controller CPLD (U1) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 product family). It is the central system management unit with module specific firmware installed to monitor and control various signals of the FPGA, on-board peripherals, I/O interfaces and module as a whole.

Gigabit Ethernet

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U7). The Ethernet PHY SGMII interface is connected to the Polarfire SoC. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U8).

SoC U2Signal NameETHSignal Description

Bank 5 - N6

SGMII0_IN_P

U7 - 1

SGMII Data Positive
Bank 5 - N7SGMII0_IN_NU7 - 2SGMII Data Negativ

Bank 5 - L5

SGMII0_OUT_P

U7 - 4

SGMII Data Positive
Bank 5 - L6SGMII0_OUT_NU7 - 5SGMII Data Negativ
Bank 2 - D3ETH_MDCU7 - 7Management Data Clock
Bank 2 - C2ETH_MDIOU7 - 8Management Date I/O
Bank 2 - E5ETH_RSTU7 - 16Hardware Reset
Bank 1 - AA16PHY_LED0U7 - 14LED Outputvia voltage-level translator
Bank 1 - Y16PHY_LED1U7 - 13LED Outputvia voltage-level translator
Bank 1 - Y14PHY_LED2U7 - 12LED Outputvia voltage-level translator
Ethernet PHY to Polarfire SoC connections

USB PHY

Hi-speed USB ULPI PHY (U11) is provided with USB3320 from Microchip. The ULPI interface is connected to the Polarfire SoC via MSSIO14...25 bank 2. The I/O voltage is fixed at 3.3 V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U12).

Bank 2Signal NameUSBSignal Description

U2 - G4

OTG-STP

U11 - 29

Stop
U2 - G5OTG-NXTU11 - 2Next

U2 - F1

OTG-DIR

U11 - 31

Direction
U2 - G2OTG-CLKU11 - 1Clock
U2 - F2

OTG_DATA0

U11 - 3ULPI bi-directional data bus
U2 -E1OTG_DATA1U11 - 4ULPI bi-directional data bus
U2 -G3OTG_DATA2U11 - 5ULPI bi-directional data bus
U2 -F5OTG_DATA3U11 - 6ULPI bi-directional data bus
U2 - D1OTG_DATA4U11 - 7ULPI bi-directional data bus
U2 -D2OTG_DATA5U11 - 9ULPI bi-directional data bus
U2 -F6OTG_DATA6U11 - 10ULPI bi-directional data bus
U2 - F3OTG_DATA7U11 - 13ULPI bi-directional data bus
U2 - E4OTG-RSTU11 - 27Reset
USB PHY to Polarfire SoC connections

LPDDR4 SDRAM

The TEM0007 SoM has a one GByte volatile LPDDR4 SDRAM IC for storing user application code and data.

  • Part number: IS43LQ32256A-062BLI
  • Supply voltage: +1.8 V / +1.1 V
  • Speed: 1600 MHz
  • Temperature:  Industrial (-40°C to +85°C)

EEPROM

There is a 2 Kbit EEPROM provided on the module TEM0007 with a pre-programmed globally unique MAC.

MSSIO PinSchematicU10 PinNotes
26I2C_SCLSCL - 1
27I2C_SDASDA - 3
I2C EEPROM interface MSSIOs and pins

MSSIO PinI2C AddressDesignatorNotes
MSSIO26...270x50U10
I2C address for EEPROM

SPI Flash Memory

The TEM0007 is equipped with a MT25QU512ABB8E12-0SIT flash memory chip, U3, which provided storage for FPGA configuration files. After configuration, the remaining free memory can be used for application data storage.

Polarfire SoC PinSchematicU3 PinNotes
SCK_3 - E6SPI_SCKCLK - B2
SS_3 - G7SPI_SSCS# - C2
SDO_3 - F7SPI_SDODI/IO0 - D3
SDI_3 - H10SPI_SDIDO/IO1 - D2
SPI_EN_3 - H11SPI_EN-
SPI Flash interface pins

Oscillators

DesignatorDescriptionFrequencyNote
U4MSS REFCLK125 MHz
U5SERDES CLK125 MHz
U12USB52 MHz
Osillators

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
VINTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

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Power Distribution

Power-On Sequence

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Power Sequency

Voltage Monitor Circuit

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Voltage Monitor Circuit

Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
























Module power rails.

Bank Voltages

Bank          

Schematic Name

Voltage

Notes




























Zynq SoC bank voltages.


Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz



Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit




V




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PS absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document



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Recommended operating conditions.

Physical Dimensions

  • Module size: ?? mm × ?? mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? mm.

PCB thickness: ?? mm.

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Physical Dimension

Currently Offered Variants 

Trenz shop TE0728 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History


DateRevisionChangesDocumentation Link
-










Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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Board hardware revision number.

Document Change History

DateRevisionContributorDescription

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  • change list

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Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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