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Table of Contents

Overview

The Trenz Electronic TE0821-01-3BI21FA is a powerful 4 x 5 cm MPSoC module with a Xilinx Zynq UltraScale + ZU3EG. In addition, the module is equipped with a 2 GB DDR4 SDRAM chip, 128 MB flash memory for configuration and data storage, as well as powerful switching power supplies for all required voltages. Robust high-speed connectors provide a large number of inputs and outputs.

This module is pin compatible with Trenz Electronic TE0820 MPSoC modules (JM2 pin 100 is not connected).

The highly integrated modules are smaller than a credit card and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are completely mechanically and largely electrically compatible with each other.

All components cover at least the industrial temperature range from -40 ° C to + 85 ° C. The temperature range in which the module can be used depends on the customer design and the selected cooling. Please contact us for special solutions.

Refer to http://trenz.org/te0821-info for the current online version of this manual and other available documentation.

Key Features

  • SoC/FPGA
    • Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784I
      • ZU3EG, 784 Pin Packages
      • Application Processor: Quad-Core ARM Cortex-A53 MPCore
      • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
      • Graphics Processor: Mali-400 MP2
  • RAM/Storage
    • 2 GByte DDR4 SDRAM, 32-Bit databus-width
    • 128 MByte QSPI boot Flash in dual parallel mode
    • 8 GByte e.MMC Memory (up to 64 GByte)
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Graphic Processing Unit (GPU) :Mali-400 MP2
  • Interface
    • PCI Express interface version 2.1 compliant
    • SATA 3.1 specification compliant interface

    • DisplayPort source-only interface with video resolution up to 4k x 2k

    • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
    • Hi-speed USB2 ULPI transceiver with full OTG support
    • 34 x High Performance und 96 x High Density PL I/Os
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers
    • Rugged for shock and high vibration
  • Power
    • All power supplies on board
  • Dimension
    • 40 x 50 mm

Block Diagram


TE0821 block diagram

Main Components

TE0821 main components
  1. Xilinx Zynq UltraScale+ XCZU3EG, U1
  2. Red LED (ERR_OUT), D3
  3. Green LED (ERR_STATUS), D4
  4. Red LED (DONE), D1
  5. GigaBit Ethernet Transceiver, U8
  6. 8Gb DDR4, U2-U3
  7. 512 Mb SPI Flash, U7-U17
  8. Board to Board Connector, JM1
  9. USB2.0 Transceiver,  U18
  10. Board to Board Connector, JM3
  11. Board to Board Connector, JM2
  12. eMMC, U17

Initial Delivery State

Storage device name

Content

Notes

SPI Flash OTP Area

Not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Not programmed

-

eFUSE USER

Not programmed

-

eFUSE Security

Not programmed

-
Si5338 OTP NVMNot programmed-
CPLD (LCMXO2-256HC)SC0820-02 QSPI FirmwareSee Boot Process section.
Initial delivery state of programmable devices on the module

Configuration Signals

Two different firmware versions are available, one with the QSPI boot option and other with the SD Card boot option.

MODE Pin

Boot Mode
Low

QSPI

HighSD Card
Boot process.

Signal

B2BI/ONote









Reset process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA BankB2B ConnectorI/O Signal CountI/O Signal CountVoltage LevelNotes

64

HP

JM2

48

User

Max voltage 1.8V

64

HP

JM2

2

User

Max voltage 1.8V
65

HP

JM2

18

User

Max voltage 1.8V

65

HP

JM3

16

User

Max voltage 1.8V

66

HP

JM1

48

User

Max voltage 1.8V
500MIOJM181.8V-

501

MIO

JM1

6

3.3V

-

505

GTR

JM3

4 lanes

-

-

505

GTR CLK

JM3

1 differential input

-

-

General PL I/O to B2B connectors information


JTAG Interface

JTAG access to the TExxxx SoM through B2B connector JMX.

JTAG Signal

B2B Connector

TMSJM2-93
TDIJM2-95
TDOJM2-97
TCKJM2-99 
JTAG pins connection

Pin 89 JTAGEN of B2B connector JM1 is used to control which device is accessible via JTAG. If set to low or grounded, JTAG interface will be routed to the Xilinx Zynq MPSoC. If pulled high, JTAG interface will be routed to the System Controller CPLD.

MIO Pins


MIO PinConnected toB2BNotes




































MIOs pins

Test Points

Test PointSignalConnected toNotes




































Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorNotes















On board peripherals

Quad SPI Flash Memory


MIO PinSchematicU?? PinNotes
























Quad SPI interface MIOs and pins


RTC

MIO PinSchematicU? PinNotes








I2C interface MIOs and pins

MIO PinI2C AddressDesignatorNotes




I2C Address for RTC


EEPROM

MIO PinSchematicU?? PinNotes








I2C EEPROM interface MIOs and pins

MIO PinI2C AddressDesignatorNotes




I2C address for EEPROM

LEDs

DesignatorColorConnected toActive LevelNote
D1RedDONEHigh
D2GreenERR_STATUSHigh
D3RedERR_OUTHigh
On-board LEDs

DDR3 SDRAM

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

U?? Pin Signal NameConnected toSignal DescriptionNote






































































Ethernet PHY to Zynq SoC connections

CAN Transceiver

BankSchematicU?? PinNotes

D-Tx
Driver Input

R-Rx
Reciever Output
CAN Tranciever interface MIOs


Clock Sources

DesignatorDescriptionFrequencyNote


MHz


MHz


KHz




Osillators

Programmable Clock Generator

There is a programmable clock generator on-board (U??) provided in order to generate variable clocks for the module. Programming can be done using I2C via PIN header J??.  The I2C Address is 0x??.

U?? Pin
SignalConnected toDirectionNote

IN0





IN1



IN2



IN3



XAXB





SCLK



SDA



OUT0



OUT1



OUT2



OUT3



OUT4



OUT5



OUT6



OUT7



OUT8/OUT9



Programmable Clock Generator Inputs and Outputs

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
VINTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

Power Sequency

Voltage Monitor Circuit

Create DrawIO object here: Attention if you copy from other page, objects are only linked.

Voltage Monitor Circuit

Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
























Module power rails.

Bank Voltages

Bank          

Schematic Name

Voltage

Notes




























Zynq SoC bank voltages.


Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz



Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnit




V




V










PS absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document



VSee ???? datasheets.



VSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.



°CSee Xilinx ???? datasheet.
Recommended operating conditions.

Physical Dimensions

  • Module size: 40 mm × 50 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

PCB thickness: 1.74 mm.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0821 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History


DateRevisionChangesDocumentation Link
2019-04-26REV01
  • Initial Release
REV01
Hardware Revision History

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Board hardware revision number.

Document Change History

DateRevisionContributorDescription

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  • Initial Release

--

all

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  • --
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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