TE0715 TRM

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Overview

The Trenz Electronic TE0715 is a System on Module (SoM) based on AMD Zynq-7000 SoC with a Quad GTP transceiver, DDR3 SDRAM, Flash memory, Gigabit Ethernet PHY, a USB 2.0 PHY and powerful switching-mode power supplies for all on-board voltages. A large number of configurable IOs is provided via rugged high-speed stacking strips. All Trenz Electronic SoMs in the 4 x 5 cm form factor are mechanically compatible.

Refer to http://trenz.org/te0715-info for the current online version of this manual and other available documentation.

Key Features

SoC/FPGA
- AMD Zynq 7000 SoC ¹⁾: XC7Z012S / XC7Z015 / XC7Z030
- Speed-grade¹⁾: -1 / -2 / -3
- Temperature Range ¹⁾: Commercial / Extended / Industrial
- Package ²⁾: CLG485 / SBG485
RAM/Storage
- DDR3 SDRAM 1 GByte ³⁾
- QSPI Flash 32 Mbyte (with XiP support) ³⁾
- EEPROM with MAC address and 192 Byte usable storage
On Board
- System Controller (SC)
- 10/100/1000 Mbit Ethernet PHY
- USB 2.0 ULPI PHY
- Real time clock (RTC) with optional battery backed SRAM support
- Programmable clock generator
- 2x LEDs for SoM and SoC configuration status
- 1x LED user configurable
Interface
- 3 x B2B Connector (LSHM) for Trenz 4 x 5 SoM socket
  - PS: 14x MIOs
  - HR: 48x IOs / 24x DIFF
  - MGT: 4x GTP
  - SoC variants XC7Z012S / XC7Z015 ⁴⁾
    - HR: 84x IOs / 23x DIFF + 2x SE
  - SoC variant XC7Z030 ⁴⁾
    - HP: 84x IOs / 41x DIFF + 2x SE
Power
- System management and power sequencing
- Voltage monitoring for all rails
- On-board DCDC converters
Dimension
- 50 mm × 40 mm
Notes
¹⁾ Available as assembly variant or upon request.
²⁾Sockets CLG484 and SBG484 are footprint-compatible.³⁾ Other sizes/devices, which are pin/package-compatible, upon request.
⁴⁾ IO type allocation differs with SoC variant.

Block Diagram

TE0715 block diagram

Main Components

TE0715 main components

AMD Zynq-7000 SoC, U5
DDR3L SDRAM, U12, U13
QSPI Flash, U14
System Controller CPLD, U26
Programmable Clock Generator , U10
10/100/1000 Mbit Ethernet PHY, U7
USB 2.0 ULPI PHY, U6
RTC with battery backed SRAM, U16
B2B connector Samtec Razor Beam™ LSHM, JM1, JM2, JM3
LED green, D2 (Boot DONE), D4
LED red (SC), D3

Initial Delivery State

Storage device name	Content	Notes
System Controller, U26	Firmware	Visit TE0715 CPLD Firmware / TE0715 CPLD for more information.
QSPI Flash, U14	Not programmed
Programmable Clock Generator, U10	Configuration
EEPROM, U19	Not programmed	Contains write protected Unique Node ID / MAC.

Initial delivery state of programmable devices on the module

Programmable Clock Generator

The programmable Clock Generator (Si5338A) is used to generate four different clocks from oscillator U18 (25 MHz) connected to pin IN3. The Si5338 can alternatively be clocked using pins IN1 and IN2 which are connected to B2B connector JM3 (CLKIN2) or by IN5 from Ethernet PHY U7 (125 MHz).

The Si5338 output frequency to the FPGA clocks can be programmed . An I2C bus is physically connecting the FPGA (master) and clock generator (slave). The I2C logic needs to be created in the FPGA to use this capability. See the reference design section for more information.

TE0715 clock generator

CLK Output I Net Name I Device.Pin	Default Frequency [MHz]	IO Standard	Notes
CLK0A/B	-	-	Not used/connected.
CLK1A/B	-	-	Not used/connected.
CLK2A/B \| CLK2_P/N / MGT_CLK1_P/N \| U5G.U5/V5	125	LVDS18	GTP transceiver clock.
CLK3A \| FCLK125 \| U5B.K2	50	CMOS18	DDR interface
CLK3B	-	-	Not used/connected.

Clock Generator output configuration

I2C Interface

The on-board I2C devices are connected to the Zynq SoC bus master at IO bank 501. As bank 501 is fixed to 1.8V, this requires a voltage-level translator for the 3.3V I2C slave devices. Table below lists I²C slave device addresses and functions:

Device	Designator	I2C Address
24AA025E48 Serial EEPROMs with EUI-48™ node identity.	U19	0x50
ISL12020M Low-power RTC with battery backed SRAM.	U16	0x6F
ISL12020M Battery backed SRAM integrated into RTC.	U16	0x57
SI5338A Programmable quad clock generator.	U10	0x70

I2C device addreses

Signals, Interfaces and Pins

Connectors

Connector Type	Designator	Interface	IO count
B2B	JM1	IO	48 SE / 24 DIFF
B2B	JM1	IO	8 SE / 4 DIFF
B2B	JM1	IO	6 SE / 4 DIFF
B2B	JM1	ETH MDI	8
B2B	JM2	IO	48 SE / 24 DIFF
B2B	JM2	IO	18 SE / 9 DIFF
B2B	JM2	IO	2 SE
B2B	JM2	JTAG	4
B2B	JM3	IO	16 SE / 8 DIFF
B2B	JM3	MGT GTP	4
B2B	JM3	Clock in MGT GTP	2
B2B	JM3	Clock in	2
B2B	JM3	USB OTG	3
B2B	JM3	ETH SGMII	4

Board Connectors

Test Points

Test Point	Signal	Notes
TP1	VIN
TP2	DDR_PWR
TP3	1.8V
TP4	3.3V
TP5	VTT
TP6	VTTREF
TP7	3.3VIN
TP8	1.2V_MGT
TP9	1V
TP10	GND
TP11	GND
TP12	GND
TP14	PG_ALL
TP15	PS-CLK
TP18	VCCIO34
TP19	VCCIO35
TP20	PS-POR-B

Test Points Information

On-board Peripherals

Chip/Interface	Designator	Connected To	Notes
SoC	U5	SC, U26 QSPI Flash, U14 LED, D2, D4 OSC, U11 B2B Connector, JM1, JM2, JM3 I2C
DDR3 RAM	U12/U13	SoC, U5
QSPI Flash	U14	SoC, U5 SC, U26
System Controller	U26	SoC, U5 QSPI Flash, U14 LED, D3 B2B Connector, JM1, JM2 I2C Voltage monitor, U25	Visit TE0715 CPLD Firmware / TE0715 CPLD for further information / firmware description.
Ethernet PHY	U7	SoC, U5 Clock Generator, U10 OSC, U9 B2B Connector, JM1, JM3
USB 2.0 PHY	U6	SoC, U5 OSC, U15 B2B Connector, JM3
Voltage level translator	U20	SoC, U5 I2C
Clock Generator	U10	SoC, U5 OSC, U18 I2C B2B Connector, JM3	Visit chapter Initial Delivery State / Programmable Clock Generator for further information.
RTC	U16	SoC, U5 I2C B2B Connector, JM1
EEPROM	U19	I2C	Contains unique Node Identity / MAC.
Oscillator	U9	Ethernet PHY, U7	25 MHz
Oscillator	U11	SoC, U5	33.3 MHz
Oscillator	U15	USB 2.0 PHY, U6	52 MHz
Oscillator	U18	Clock Generator U10	25 MHz

On board peripherals

Configuration and System Control Signals

Signal Name	Connector.Pin	Direction¹⁾	Description
EN1	JM1.28	Signal dependent	SoM power enable or SC JTAG TDI. ²⁾
PGOOD	JM1.30	Signal dependent	Power good signal, additional boot mode pin or SC JTAG TDO. ²⁾ Active high when all on-module power supplies are working properly.
MODE	JM1.32	Signal dependent	Sets the SoM boot source/mode or functions as SC JTAG TCL. ²⁾
NOSEQ	JM1.7	Signal dependent	Can be used as IO signal, accessible via SoC I2C or as SC JTAG TMS. ²⁾
JTAGEN	JM1.89	IN	Enables SC JTAG port, when high.
RESIN	JM2.18	IN	Reset signal to the SoM.
VBUS_V_EN USB_VBUS	JM3.53 JM3.55	OUT IN	USB OTG VBus enable. Voltage state signal to SoM.
TDI	JM2.95	IN	SoC JTAG TDI.
TDO	JM2.97	OUT	SoC JTAG TDO.
TCK	JM2.99	IN	SoC JTAG TCK.
TMS	JM2.93	IN	SoC JTAG TMS.
MIO14 MIO15	JM1.92 JM1.87	Signal dependent	SoC UART.
VCCIO13	JM1.9 / JM1.11	IN	SoC IO Bank supply from carrier
VCCIO34	JM2.5	IN	SoC IO Bank supply from carrier
VCCIO35	JM2.7/JM2.9	IN	SoC IO Bank supply from carrier

¹⁾ Direction:

- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.
- Signal dependent: Signal can have different functions and/or directions, or is part of a bus where no differentiation is made.

²⁾ When JTAGEN is high, the signal works as part of a JTAG connection to program or update the System Controller.

Controller signal.

Power and Power-On Sequence

Power Rails

Power Rail Name/ Schematic Name	Connector.Pin	Direction¹⁾
3.3VIN	JM1.13 / JM1.15	IN
VIN	JM1.1 / JM1.3 / JM1.5 / JM2.2 / JM2.4 / JM2.6 / JM2.8	IN
VBAT_IN	JM1.79	IN
VCCIO13	JM1.9 / JM1.11	IN
VCCIO34	JM2.5	IN
VCCIO35	JM2.7 / JM2.9	IN
3.3V / VREF_JTAG	JM2.91	OUT
1.8V	JM1.39	OUT
DDR_PWR	JM2.19	OUT

¹⁾ Direction:

- IN: Input from the point of view of this board.
- OUT: Output from the point of view of this board.

Module power rails.

Recommended Power up Sequencing

Sequence	Net name	Recommended Voltage Range	Pull-up/down	Description	Notes
0	-	-	-	Configuration SoM / Carrier signal setup.	See Configuration and System Control Signals.
1	3.3VIN	3.3 V (± 5 %)	-	Main Power supply. Supplies System Controller directly.
2	VIN	3.3 V (± 5 %)	-	Main Power supply.
3	EN1	3.3 V (± 5 %)	-	Enable SoM.
4	PGOOD	3.3 V (± 5 %)	-	SoM power good signal.	All SoM power sources are available.
6	VCCIO13 VCCIO34 VCCIO35	-	-	Enable FPGA bank IO supply voltages.

Refer to Trenz 4 x 5 SoM Integration Guide, FAQ - PCBDesign, AMD data sheet DS187 (for XC7Z012S / XC7Z015) or DS191 (for XC7Z030) for more information.

Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)

Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order number	Connector on baseboard	compatible to	Mating height
23836	REF-189016-01	LSHM-150-02.5-L-DV-A-S-K-TR	6.5 mm
	LSHM-150-03.0-L-DV-A-S-K-TR	LSHM-150-03.0-L-DV-A-S-K-TR	7.0 mm
23838	REF-189016-02	LSHM-150-04.0-L-DV-A-S-K-TR	8.0 mm
	LSHM-150-06.0-L-DV-A-S-K-TR	LSHM-150-06.0-L-DV-A-S-K-TR	10.0mm
26125	REF-189017-01	LSHM-130-02.5-L-DV-A-S-K-TR	6.5 mm
	LSHM-130-03.0-L-DV-A-S-K-TR	LSHM-130-03.0-L-DV-A-S-K-TR	7.0 mm
24903	REF-189017-02	LSHM-130-04.0-L-DV-A-S-K-TR	8.0 mm
	LSHM-130-06.0-L-DV-A-S-K-TR	LSHM-130-06.0-L-DV-A-S-K-TR	10.0mm

Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking height	Speed rating
12 mm, Single-Ended	7.5 GHz / 15 Gbps
12 mm, Differential	6.5 GHz / 13 Gbps
5 mm, Single-Ended	11.5 GHz / 23 Gbps
5 mm, Differential	7.0 GHz / 14 Gbps

Speed rating.

Current Rating

Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings

Shock: 100G, 6 ms Sine
Vibration: 7.5G random, 2 hours per axis, 3 axes total

Manufacturer Documentation

	File	Modified
	PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report	Apr 07, 2016 by Thorsten Trenz
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	PDF File lshm_dv.pdf LSHM catalog page	Apr 07, 2016 by Thorsten Trenz
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	PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing	Apr 07, 2016 by Thorsten Trenz
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	PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing	Apr 07, 2016 by Thorsten Trenz
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	PDF File REF-189016-01.pdf Technical Drawing	Apr 07, 2016 by Thorsten Trenz
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	PDF File REF-189016-02.pdf Technical Drawing	Apr 07, 2016 by Thorsten Trenz
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	PDF File REF-189017-01.pdf Technical Drawing	Apr 07, 2016 by Thorsten Trenz
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	PDF File REF-189017-02.pdf Technical Drawing	Apr 07, 2016 by Thorsten Trenz
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	PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report	Apr 07, 2016 by Thorsten Trenz
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	PDF File tc0929--2611_qua(1).pdf Shock and vibration report	Apr 07, 2016 by Thorsten Trenz
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Technical Specifications

This TRM is generic for all variants.

The voltage ranges are generally the same across variants (exceptions are possible, depending on custom requests).
The temperature range can differ depending on the assembly version.
The combination of a carrier and a SoM might have different requirements.

Module variants are described here: Article Number Information. Please contact us for options.

Absolute Maximum Ratings ^*)

Power Rail Name/ Schematic Name	Description	Min	Max	Unit
3.3VIN	Supply power from carrier. Powers SC directly.	–0.5	3.6	V
VIN	Supply power from carrier.	-0.3	6	V
VBAT_IN	SoC, RTC/Volatile Memory supply.	-0.3	6	V
VCCIO13	IO Bank supply for SoM.	–0.5	3.6	V
VCCIO34	IO Bank supply for SoM.	–0.5 –0.5	3.6 ¹⁾ 2.0 ²⁾	V V
VCCIO35	IO Bank supply for SoM.	–0.5 –0.5	3.6 ¹⁾ 2.0 ²⁾	V V

¹⁾ The SoC's XC7Z012S / XC7Z015 feature only HR Banks, which are limited to a maximum of 3.6 V.
²⁾ The SoC's XC7Z030 IO Banks 34 and 35 are HP Banks, which are limited to a maximum of 2 V.

Absolute maximum ratings

^*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Temperature range

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
Cooling solution, active and or passive cooling.
Climate or environmental conditions besides ambient temperature range.
Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.

Classification of the module can be locked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).

Parameter	Min	Max	Units
3.3VIN	3.15	3.45	V
VIN	3.135	5.25	V
VBAT_IN	2.91	3.09	V
VCCIO13	1.164	3.399	V
VCCIO34	1.164 1.164	3.399 ¹⁾ 1.854 ²⁾	V V
VCCIO35	1.164 1.164	3.399 ¹⁾ 1.854 ²⁾	V V

¹⁾ The SoC's XC7Z012S / XC7Z015 feature only HR IO Banks, which are limited to a maximum of 3.3 V.
²⁾ The SoC XC7Z030 IO Banks 34 and 35 are HP IO Banks, which are limited to a maximum of 1.8 V.

Recommended operating conditions.

Physical Dimensions

Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.6 mm ±10 %.

All dimensions are shown in millimeters.

Physical Dimension

Currently Offered Variants

Trenz shop TE0715 overview page*
English page	German page

*) Module article name encoding table: 7 Series Zynq-7000 based modules

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

The hardware revision number is located on the PCB next to the module identifier, separated by a dash.

Board hardware revision number.

Date	Revision	Changes	Documentation Link
2022-03	05	1. SI5338 OTP content update 2. Revised power supply circuit: replaced obsolete parts U1, U2, U3,U8,U24, Q1. 3. Added power supervisor BD39040MUF (U25). Signal PG_DDR_PWR renamed to PG_All (U25) and connected to system controller (U26.27). 4. Signal MIO8 (U5.E18) connected to system controller (U26.8). 5. Power supervisor U23 connected to 3.3VIN power rail (was 3.3V). Added protection diode D5 to U23.3 (#MR input) 6. Revised quantity of decoupling capacitors regarding Xilinx Spec (UG933, v1.13.1). 7. Remove GND connection from "RSVDGND" (U5.G12, Xilinx Spec UG865 v1.9). 8. Auxiliary information has been added on Overview, Power_diagram, Legal_Notices pages. 9. PCB: Revised layout of power supplies. 10. PCB: Revised layout of Samtec B2B signals. The length of the tracks has been changed. Pinout of Samtec B2B connectors not affected. 11. SCH & PCB: Full LIB update. 12. Replace EN6347QI (U1) by MPM3840GQV-Z. 13. Replace TPS82085SIL (U2, U3, U8, U24) by MPM3834CGPA. 14. Replace TPS27082LDDCR (Q1) by MP5077GG-Z. 15. Add power supervisor BD39040MUF (U25). 16. Add protection diode D5 to U23.3 (#MR input). 17. Connect power supervisor U23 to 3.3VIN power rail (was 3.3V). 18. Change voltage divider resistors (R56, R58) to set the threshold for U23. 19. Change net name "PG_DDR_PWR" to "PG_All" and connect BD39040MUF "PG_All" - signal U25.15 to system controller U26.27 with pull-up resistor R67. 20. Connect MIO8-Signal "SPE_SCK_FB/VCFG1" (U5.E18) to system controller (U26.8). 21. Connect net "PS-POR-B" via resistor R75 net name "RST" to system controller (U26.9). 22. Change pull-down/floating status for U5.T16 and U5.U16 for revision indicator. 23. Remove GND connection from FPGA "RSVDGND" pin (U5.G12). 24. Replace BKP0603HS121-T (L1, L2, L3, L4, L5, L6, L7, L8, L9, L11) by MPZ0603S121HT000. 25. Change decoupling capacitor (C9, C30) from net "1.8V" at pin U5 bank 501 to net "1V". 26. Remove decoupling capacitor (C12) for net "1.8V" at pin U5 bank 501. 27. Add decoupling capacitor (C50, C51, C88, C89, C108, C118) for net "1V". 28. Change decoupling capacitor (C21, C144) for VCCPLL. 29. Add/Change decoupling capacitor (C107, C128) for VCCAUX and VCCPAUX. 30. Add decoupling capacitor (C128) for AVDD3. 31. Change decoupling capacitor (C136, C142, C139, C145) for net DDR_PWR. 32. Add/Change decoupling capacitor (C50, C51, C86, C88, C89, C108, C118) for VCCBRAM. 33. Add input capacitor (C153, C154) for DCDC U4. 34. Change resistor (R21) physical size. 35. LIB update. 36. Change PCB layout of Samtec B2B signals. 37. Change schematic documentation.	REV05 PCN PCN
2016-07	04	1. Change DDR3 RAM (U12, U13) from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI. 2. Clock Revision Change (U11, U15) SiT8008AI-... to SiT8008BI-... . 3. Set S/N to not fitted. 4. Replaced Level translator LFXLA101L6X (U21) by FXLH1T45L6X. 5. Fixed Xilinx AR# 65240. 6. Added Test Points. 7. Changed U9 supply to 1.8V. 8. Reworked Power Supply. 9. Changed DDR3 RAM to DDR3L RAM.	REV04 PCN PCN PCN
2015-07	03		REV03
2015-04	02		REV02
2015-02	01

Hardware Revision History

Document Change History

Date	Revision	Contributors	Description
2026-07-09	v.97	Kilian Jahn	Configuration and System Control Signals - VBus signal B2B fixed
2026-02-19	v.96	Kilian Jahn	Updated to TRM Template 4.3
2024-06-19	v.90	Waldemar Hanemann	Updated Key features: DCDC current rating Added revision 5 in Hardware revision history
2021-06-21	v.87	John Hartfiel	Bugfix Link to PDF download
2018-07-06	v.86	John Hartfiel	Link to shop production list Change normal Bank power note to important note
2017-11-14	v.85	John Hartfiel	Replace B2B connector section
2017-09-10	v.82	Jan Kumann	Document template revision added. Revised block diagram with new I²C part. Power distribution diagram added. Power-on sequence diagram added. Sections rearranged, some missing ones added. Weight section removed.
2017-06-07	v.64	Jan Kumann	Minor formatting.
2017-03-02	v.59	Thorsten Trenz	Corrected boot mode table.
2017-02-10	v.58	Thorsten Trenz	Corrected PLL initial delivery state.
2017-01-25	v.55	Jan Kumann	New block diagram.
2017-01-14	v.50	Jan Kumann	Product revision 04 images added. Formatting changes and small corrections.
2016-11-15	v.45	Thorsten Trenz	Added B2B Connector section.
2016-10-18	v.40	Ali Naseri	Added table "power rails".
2016-06-28	v.38	Thorsten Trenz, Emmanuel Vassilakis, Jan Kumann	New overall document layout with shorter table of contents. Revision 01 PCB pictures replaced with the revision 03 ones. Fixed link to Master Pin-out Table. New default MIO mapping table design. Revised Power-on section. Added links to related Xilinx online documents. Physical dimensions pictures revised. Revision number picture with explanation added.
2016-04-27	v.33	Thorsten Trenz, Emmanuel Vassilakis	Added table "Recommended Operating Conditions". Storage Temperature edited.
2016-03-31	v.10	Philipp Bernhardt, Antti Lukats	Initial version.

Table 22: Document change history.

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REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

2025-08-01

Trenz Electronic Documentation